MD simulation of a copper rod under thermal shock

Acta Mechanica Sinica/Lixue Xuebao

Volumn 26, Issue 4, 2010, Pages 599-604

  Xia, Rong Hou ^a,b   Tian, Xiao Geng ^a   Shen, Ya Peng ^a  

^a XI'AN JIAOTONG UNIVERSITY   (China)

^b XI'AN UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Embedded atom method potential; Molecular dynamics simulation; Thermal stress; Thermoelastic coupling

Indexed keywords

COPPER ROD; EMBEDDED-ATOM METHOD POTENTIALS; FREE BOUNDARY CONDITIONS; GENERALIZED THERMOELASTIC THEORIES; HEAT PROPAGATION; MD SIMULATION; MOLECULAR DYNAMICS METHODS; MOLECULAR DYNAMICS SIMULATION; PARALLEL SIMULATOR; SIMULATION RESULT; STRESS DISTRIBUTION; THERMOELASTIC COUPLINGS; THERMOELASTIC PROBLEMS; VISUALIZATION SOFTWARE;

ATOMS; COMPUTER SOFTWARE; CRACK PROPAGATION; MOLECULAR MECHANICS; SPEED; STRESS CONCENTRATION; THERMAL SHOCK; THERMAL STRESS; THERMOELASTICITY; VISUALIZATION;

MOLECULAR DYNAMICS;

EID: 77956619070     PISSN: 05677718     EISSN: None     Source Type: Journal    
DOI: 10.1007/s10409-010-0363-2     Document Type: Article

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