Corrosive microenvironments at lead solder surfaces arising from galvanic corrosion with copper pipe

Environmental Science and Technology

Volumn 44, Issue 18, 2010, Pages 7076-7081

  Nguyen, Caroline K ^a   Stone, Kendall R ^a   Dudi, Abhijeet ^a   Edwards, Marc A ^a  

^a Virginia Polytechnic Institute and State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHLORIDE CONCENTRATIONS; GALVANIC CORROSION; GALVANIC CURRENT; LEAD CONTAMINATION; LEAD LEACHING; LEAD SOLDERS; MICROENVIRONMENTS; STAGNANT WATER; TOTAL MASS;

CHLORINE COMPOUNDS; COPPER; COPPER PIPE; CORROSION; LEACHING; LEAD; PASSIVATION; POTABLE WATER; WATER LEVELS; WATER SUPPLY;

TIN;

COPPER; LEAD;

CHLORIDE; COPPER; CORROSION; EXPERIMENTAL STUDY; LEACHING; LEAD; PH; PIPE; SULFATE; WATER SUPPLY;

ARTICLE; CHEMICAL ANALYSIS; CORRELATION ANALYSIS; CORROSION; GALVANIC CURRENT; LEACHING; MICROENVIRONMENT; SIMULATION; WATER ANALYSIS; WATER CONTAMINATION;

ANIONS; CHLORIDES; COPPER; CORROSION; ELECTRICITY; ELECTRODES; HYDROGEN-ION CONCENTRATION; LEAD; SOLUBILITY; SULFATES; SURFACE PROPERTIES; WATER; WATER POLLUTANTS, CHEMICAL; WATER SUPPLY;

EID: 77956556553     PISSN: 0013936X     EISSN: 15205851     Source Type: Journal    
DOI: 10.1021/es1015185     Document Type: Article

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