A RFID-enabled tracking system in wire bond station of an IC packaging assemble line

Proceedings of 2010 IEEE International Conference on RFID-Technology and Applications, RFID-TA 2010

Volumn , Issue , 2010, Pages 170-175

  Wang, W L ^a   Liu, Y J ^a   Wang, S J ^a  

^a NATIONAL CHIN YI UNIVERSITY OF TECHNOLOGY   (Taiwan)

Author keywords

IC packaging; RFID; Tracking; Wire bond

Indexed keywords

BEFORE AND AFTER; CUSTOMER REQUIREMENTS; IC INDUSTRY; IC PACKAGING; PERFORMANCE IMPROVEMENTS; PRODUCT DIVERSIFICATION; PRODUCTION LINE; RAPID DEVELOPMENT; REAL-TIME MONITOR; RFID; TRACKING; TRACKING SYSTEM; WIRE BOND; WIRE BONDS; WORK-IN-PROCESS;

NAVIGATION; PACKAGING;

WIRE;

EID: 77956428051     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/RFID-TA.2010.5529881     Document Type: Conference Paper

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