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Volumn 90, Issue 30, 2010, Pages 4041-4054
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Grain boundary sliding during ambient-temperature creep in hexagonal close-packed metals
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Author keywords
ambient temperature creep; grain boundary sliding; hexagonal close packed structure
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Indexed keywords
0.2% PROOF STRESS;
AMBIENT TEMPERATURE CREEP;
AMBIENT TEMPERATURES;
APPARENT ACTIVATION ENERGY;
CREEP BEHAVIOUR;
CREEP DEFORMATIONS;
DIFFUSION PROCESS;
DISLOCATION ARRAYS;
ELECTRON BACK SCATTER DIFFRACTION;
GRAIN-BOUNDARY SLIDINGS;
HEXAGONAL CLOSE-PACKED;
LATTICE DISLOCATIONS;
LATTICE ROTATIONS;
METALS AND ALLOYS;
PATTERN ANALYSIS;
PILE-UPS;
SINGLE SLIP;
ACTIVATION ENERGY;
ATOMIC FORCE MICROSCOPY;
CREEP;
DIFFRACTION;
GRAIN BOUNDARIES;
GRAIN SIZE AND SHAPE;
HOLOGRAPHIC INTERFEROMETRY;
METALLURGY;
TEMPERATURE;
GRAIN BOUNDARY SLIDING;
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EID: 77956379680
PISSN: 14786435
EISSN: 14786443
Source Type: Journal
DOI: 10.1080/14786435.2010.502883 Document Type: Article |
Times cited : (37)
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References (40)
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