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Volumn 90, Issue 30, 2010, Pages 4041-4054

Grain boundary sliding during ambient-temperature creep in hexagonal close-packed metals

Author keywords

ambient temperature creep; grain boundary sliding; hexagonal close packed structure

Indexed keywords

0.2% PROOF STRESS; AMBIENT TEMPERATURE CREEP; AMBIENT TEMPERATURES; APPARENT ACTIVATION ENERGY; CREEP BEHAVIOUR; CREEP DEFORMATIONS; DIFFUSION PROCESS; DISLOCATION ARRAYS; ELECTRON BACK SCATTER DIFFRACTION; GRAIN-BOUNDARY SLIDINGS; HEXAGONAL CLOSE-PACKED; LATTICE DISLOCATIONS; LATTICE ROTATIONS; METALS AND ALLOYS; PATTERN ANALYSIS; PILE-UPS; SINGLE SLIP;

EID: 77956379680     PISSN: 14786435     EISSN: 14786443     Source Type: Journal    
DOI: 10.1080/14786435.2010.502883     Document Type: Article
Times cited : (37)

References (40)
  • 37


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.