Preparation of a composite plate using nonmetallic materials powder from the waste printed circuit boards

2010 4th International Conference on Bioinformatics and Biomedical Engineering, iCBBE 2010

Volumn , Issue , 2010, Pages

  Yin, Jin ^a,b   Li, Guangming ^a   He, Wen Zhi ^a  

^a TONGJI UNIVERSITY   (China)

^b YANGZHOU UNIVERSITY   (China)

Author keywords

Composite plate; Filler particles; Mechanical properties; Printed circuit boards(pcbs)

Indexed keywords

APPLICATION PROSPECT; BASE RESIN; COMPOSITE PLATES; ELECTRICAL AND ELECTRONIC EQUIPMENT; ENVIRONMENTAL CRISIS; FILLER PARTICLES; GROWING MARKETS; INNER STRUCTURE; MALEIC ANHYDRIDE GRAFTED POLYPROPYLENE; PROPERTIES OF COMPOSITES; RECYCLING WASTES; TREATMENT SYSTEMS; WASTE ELECTRICAL AND ELECTRONIC EQUIPMENT; WASTE PRINTED CIRCUIT BOARD;

AMPLIFIERS (ELECTRONIC); BENDING STRENGTH; BIOINFORMATICS; FILLERS; FRACTOGRAPHY; FRACTURE MECHANICS; IMPACT STRENGTH; MALEIC ANHYDRIDE; MECHANICAL PROPERTIES; NONMETALLIC MATERIALS; OSCILLATORS (ELECTRONIC); PLATES (STRUCTURAL COMPONENTS); POLYPROPYLENES; PRINTED CIRCUIT MANUFACTURE; RESINS; TENSILE STRENGTH; THERMOPLASTICS; WASTE TREATMENT;

PRINTED CIRCUIT BOARDS;

EID: 77956137014     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICBBE.2010.5516729     Document Type: Conference Paper

References (12)

1. UNU.2007 "review of directive 2002/96 on waste electrical and electronic equipment (WEEE). final report to European commission" ,bonn;2007
2. Bernardes A.; Bohlinger I.; Rodriguez D.; Milbrandt H.; Wuth W. "Recycling of Printed Circuit Boards by Melting with Oxidising/Reducing Top Blowing Process"; TMS Annual Meeting; Orlando, FL, 1997; 363-375.
3. Silicon valley toxic coalition, Just say no to E-waste: Background document on hazards and waste from computers. http://www.svtc.org/cleancc/pubs/ sayno.htm, 2003-01-06.
4. Hugo Marcelo Veit, Andr'ea Moura Bernardes, Jane Zoppas Ferreira, Jorge Alberto Soares Ten'orio, C'elia de Fraga Malfatti. "Recovery of copper from printed circuit boards scraps by mechanical processing and electrometallurgy". Journal of Hazardous Materials. B137(2006) 1704-1709.
5. D. Pilone, G.H. Kelsall. "Prediction and measurement of multi-metal electrodeposition rates and efficiencies in aqueous acidic chloride media". Electrochimica Acta. 51 (2006) 3802-3808.
6. Jae-chun Lee, Hyo Teak Song, Jae-Min Yoo. "Present status of the recycling of waste electrical and electronic equipment in Korea". Resources, Conservation and Recycling. 50 (2007) 380-397.
7. Jae-Min Yoo, Jinki Jeong, Kyoungkeun Yoo, Jae-chun Lee , Wonbaek Kim. "Enrichment of the metallic components from waste printed circuit boards by a mechanical separation process using a stamp mill". Waste Management. 29 (2009) 1132-1137.
8. Kui Huang, Jie Guo, Zhenming Xu. "Recycling of waste printed circuit boards: A review of current technologies and treatment status in China". Journal of Hazardous Materials. 164 (2009) 399-408.
9. Wenzhi He, Guangming Li, Xingfa Ma, Hua Wang, Juwen Huang, Min Xu, Chunjie Huang. "WEEE recovery strategies and the WEEE treatment status in China". Journal of Hazardous Materials. B136 (2006) 502-512.
10. National Plastic Standardization Technical Committee, " Plastic Standard Daquan: Plastic-based standards and a common approach (2nd Edition)", Standards Press of China, 2005
11. J. Lou, V. Harinath, "Effects of mineral fillers on polystyrene melt processing", Journal of Materials Processing Technology. 152 (2004) 185-189.
12. E.E. Ferg, N. Rust, "The effect of Pb and other elements found in recycled polypropylene on the manufacturing of lead-acid battery cases", Polymer Testing .26 (2007) 1001-1014.