Effect of the substrate thickness of counter-flow microchannel heat exchangers on the heat transfer behaviors

3CA 2010 - 2010 International Symposium on Computer, Communication, Control and Automation

Volumn 2, Issue , 2010, Pages 17-20

  Dang, Thanhtrung ^a,b   Teng, Jyh Tong ^a  

^a CHUNG YUAN CHRISTIAN UNIVERSITY   (Taiwan)

^b HO CHI MINH CITY UNIVERSITY OF TECHNOLOGY AND EDUCATION   (Viet Nam)

Author keywords

Heat transfer behavior; Heat transfer rate; Micro heat exchanger; Numerical simulation; Temperature profile

Indexed keywords

HEAT TRANSFER BEHAVIOR; HEAT TRANSFER RATE; MICRO-HEAT EXCHANGERS; NUMERICAL SIMULATION; TEMPERATURE PROFILE;

COMPUTER SIMULATION; FINITE ELEMENT METHOD; HEAT TRANSFER; INLET FLOW; MATHEMATICAL MODELS; MICROCHANNELS; SPECIFIC HEAT; SUBSTRATES; TEMPERATURE CONTROL;

HEAT EXCHANGERS;

EID: 77956120370     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/3CA.2010.5533610     Document Type: Conference Paper

References (8)

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