Subcooled flow boiling heat transfer and associated bubble characteristics of FC-72 on a heated micro-pin-finned silicon chip

International Journal of Heat and Mass Transfer

Volumn 53, Issue 23-24, 2010, Pages 5605-5621

  Chang, W R ^a   Chen, C A ^a   Ke, J H ^a   Lin, T F ^a  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

Author keywords

Bubble characteristics; FC 72; Micro pin fins; Subcooled flow boiling

Indexed keywords

ACTIVE NUCLEATION SITE DENSITY; BUBBLE CHARACTERISTICS; BUBBLE DEPARTURE DIAMETER; CHIP SURFACES; COOLANT MASS FLUX; DEPARTURE FREQUENCY; DIFFERENT GEOMETRY; EMPIRICAL CORRELATIONS; FC-72; FLOW BOILING HEAT TRANSFER; HORIZONTAL RECTANGULAR CHANNEL; INLET SUBCOOLING; LIQUID SUBCOOLING; MASS FLUX; MEASURED DATA; MICRO PIN FINS; PIN-FINS; SILICON CHIP; SUBCOOLED FLOW BOILING;

COOLANTS; FINS (HEAT EXCHANGE); FORCED CONVECTION; HEAT FLUX; HEAT TRANSFER COEFFICIENTS; INLET FLOW; MICROCHANNELS; NUCLEATION;

BOILING LIQUIDS;

EID: 77956062823     PISSN: 00179310     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijheatmasstransfer.2010.05.014     Document Type: Article

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