Shell material's performance of the microcapsule for electrolytic co-deposition

International Journal of Modern Physics B

Volumn 24, Issue 15-16, 2010, Pages 3124-3130

  Liu, Hui Cong ^a   Xu, Xiu Qing ^a   Li, Wei Ping ^a   Guo, Yan Hong ^a   Zhu, Li Qun ^a  

^a BEIHANG UNIVERSITY   (China)

Author keywords

composite copper coating containing microcapsules; permeability; Shell material; tensile property

Indexed keywords

EID: 77956050203     PISSN: 02179792     EISSN: None     Source Type: Journal    
DOI: 10.1142/S0217979210066197     Document Type: Conference Paper

References (9)

1. J. Song, L.Chen, X. J. Li, Microencapsule Technology and Application (Chemical Industry Press, Beijing, 2004).
2. L. Q. Zhu, W. Zhang, F. Liu, J. Mater. Sci. 39, 495(2004).
3. L. Q. Zhu, Q. L. Xia, F. Liu, J. Funct. Mater. 4, 454(2003).
4. T. L. Zheng, L. Q. Zhu, W. Zhang, Acta. Aero & Astro. Sci. 1, 147(2006).
5. L. Q. Zhu, Funtional Coatings by Polymer Microencapsulation (WILEY, New York, 2006).
6. B. Q. Wang, S. H. Li, Appl. Chem. Ind. 9, 519(2005).
7. L. Q. Zhu, Y. H. Guo, W. P. Li, et al, J. Funct. Mater.9, 1507(2008).
8. R. Sarawut, J. Sorada, Carbohydrate Polymers.72, 444 (2008).
9. L. M. Chen, H. P. Cai, Packing Eng. 2, 31(2006).