32nm and beyond multi-VT ultra-thin body and BOX FDSOI: From device to circuit

ISCAS 2010 - 2010 IEEE International Symposium on Circuits and Systems: Nano-Bio Circuit Fabrics and Systems

Volumn , Issue , 2010, Pages 1703-1706

  Thomas, O ^a   Noel, J P ^a   Fenouillet Beranger, C ^a,b   Jaud, M A ^a   Dura, J ^a   Perreau, P ^a,b   Boeuf, F ^b   Andrieu, F ^a   Delprat, D ^c   Boedt, F ^c   Bourdelle, K ^c   Nguyen, B Y ^c   Vladimirescu, A ^d   Amara, A ^d  

^a CEA LETI   (France)

^b STMICROELECTRONICS   (France)

^c PARC TECHNOLOGIQUE DES FONTAINES   (France)

^d ISEP   (France)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRICAL CHARACTERISTIC; ELECTROSTATIC CONTROL; HIGH-THRESHOLD VOLTAGES; MANUFACTURABILITY; PHYSICAL DESIGN; PROCESS FLOWS; ULTRA-THIN; ULTRATHIN BODY;

DIGITAL INTEGRATED CIRCUITS; FABRICS;

ELECTROSTATIC DEVICES;

EID: 77955999729     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISCAS.2010.5537517     Document Type: Conference Paper

References (9)

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4. T. Ernst, IEDM 2008
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6. K. Mistry, IEDM 2007
7. D. Pham, SOI Conferene 2006
8. J-P. Noel, ESSDERC 2009
9. C. Fenouillet-Beranger, ESSDERC 2009