Study on the preparation of the SiCp/Al-20Si-3Cu functionally graded material using spray deposition

Materials Science and Engineering: A

Volumn 527, Issue 24-25, 2010, Pages 6660-6665

  Su, B ^a   Yan, H G ^a   Chen, G ^a   Shi, J L ^a   Chen, J H ^a   Zeng, P L ^a  

^a HUNAN UNIVERSITY   (China)

Author keywords

Functionally gradient material; Preparation; SiCp Al 20Si 3Cu; Spray deposition

Indexed keywords

AUTOMATION; BINARY ALLOYS; COPPER ALLOYS; DEPOSITS; FUNCTIONALLY GRADED MATERIALS; PREFORMING; X RAY DIFFRACTION;

AUTOMATIC CONTROL SYSTEMS; DEPOSITION TECHNIQUE; FUNCTIONALLY GRADIENT MATERIALS; PREPARATION; SECONDARY PHASE; SICP/AL; SICP/AL-20SI-3CU; SPRAY DEPOSITION; WEIGHT FRACTIONS; X- RAY DIFFRACTIONS;

SILICON CARBIDE;

EID: 77955925549     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2010.06.090     Document Type: Article

References (16)

1. Gui M., Kang S.B., Euh K. Scr. Mater. 2005, 52:51.
2. Lim S.C., Gupta M., Leng Y.F., Laverniab E.J. J. Mater. Process. Technol. 1997, 63:865-870.
3. Estrada J.L., Duszczyk J. J. Mater. Sci. 1990, 25:886.
4. Seok H.K., Lee J.C., Lee H.I. J. Mater. Process. Technol. 2005, 160:354-360.
5. Shorowordi K.M., Haseeb A.S.M.A., Celis J.P. Wear 2004, 256:1176-1181.
6. Mondal D.P., Das S. Tribol. Int. 2006, 39:470-478.
7. Ding H.Z., Biermann H., Hartmann O. Compos. Sci. Technol. 2002, 62:2189-2199.
8. Rohatgi P.K., Alaraj S., Thakkar R.B., Daoud A. Compos. Part A 2007, 38:1829-1841.
9. Eslamian M., Rak J., Ashgriz N. Powder Technol. 2008, 184:11-20.
10. Yang Y., Lan J., Li X.C. Mater. Sci. Eng. A 2004, 380:378-383.
11. Chaudhury S.K., Panigrahi S.C. J. Mater. Process. Technol. 2007, 182:343-351.
12. Bassani P., Capello E., Colombo D., Previtali B., Vedani M. Compos. Part A 2007, 38:1089-1098.
13. Wang F., Yang B., Duan X.J., Xiong B.Q., Zhang J.S. J. Mater. Process. Technol. 2003, 137:191-194.
14. Vahlas C., Caussat B.G., Serp P., Angelopoulos G.N. Mater. Sci. Eng. R. 2006, 53:1-72.
15. Nai S.M.L., Gupta M. MRS Bull. 2003, 38:1573-1589.
16. Gupta M., Loke C.Y. Mater. Sci. Eng. 2000, A276:210-217.