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Volumn 18, Issue 1, 2010, Pages 47-52
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Composition-dependent curing behavior and peel strength of epoxy resins for printed circuit boards (PCBs)
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Author keywords
curing; epoxy resin; PCB; peel strength; surface roughness
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Indexed keywords
COPPER LAYER;
CURING BEHAVIOR;
EPOXY FILMS;
INSULATING FILM;
ISOTHERMAL CONDITIONS;
MANUFACTURING PROCESS;
PCB;
PEEL STRENGTH;
SEM;
CURING;
EPOXY RESINS;
METAL ANALYSIS;
PRINTED CIRCUIT MANUFACTURE;
SURFACE MORPHOLOGY;
SURFACE PROPERTIES;
SURFACE ROUGHNESS;
SYNTHETIC RESINS;
TELEPHONE CIRCUITS;
VISCOSITY MEASUREMENT;
PRINTED CIRCUIT BOARDS;
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EID: 77955885745
PISSN: 15985032
EISSN: 20927673
Source Type: Journal
DOI: 10.1007/s13233-009-0095-y Document Type: Article |
Times cited : (11)
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References (23)
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