Development of near hermetic silicon/glass cavities for packaging of integrated lithium micro batteries

Microsystem Technologies

Volumn 16, Issue 7, 2010, Pages 1119-1129

  Marquardt, Krystan ^a   Hahn, Robert ^a   Blechert, Martin ^b   Lehmann, Marco ^b   Töpper, Michael ^a   Wilke, Martin ^a   Semionyk, Peter ^a   Von Suchodoletz, Maria ^a   Reichl, Herbert ^a  

^a FRAUNHOFER IZM   (Germany)

^b TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

BATTERY LIFETIME; BONDING PARAMETERS; CONTACT PADS; DEEP CAVITY; ELECTRICAL CONTACTS; ELECTRICAL TESTS; ENERGY DENSITY; GLASS SUBSTRATES; HERMETIC PACKAGING; LITHIUM MICRO-BATTERY; LITHIUM POLYMER BATTERIES; MEMSDEVICES; MICRO BATTERY; SHEAR FORCE; SILICON CHIP; UV-CURABLE EPOXIES; WAFER LEVEL PROCESSING; WATER PERMEATION RATE;

CATALYST ACTIVITY; LITHIUM; SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS; SUBSTRATES; WAFER BONDING;

CHIP SCALE PACKAGES;

EID: 77955852260     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-009-0954-7     Document Type: Conference Paper

References (13)

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