Effect of parameters of square-wave pulsating current on copper electrodeposition in the hydrogen co-deposition range

Electrochemistry Communications

Volumn 12, Issue 6, 2010, Pages 740-744

  Nikolić, Nebojša D ^a   Branković, Goran ^b  

^a UNIVERSITY OF BELGRADE   (Serbia)

^b UNIVERSITY OF BELGRADE   (Serbia)

Author keywords

Copper; Electrodeposition; Morphology; Pulsating current; Scanning electron microscope (SEM)

Indexed keywords

AVERAGE CURRENTS; CODEPOSITION; COPPER ELECTRODEPOSITION; EFFECT OF PARAMETERS; HYDROGEN EVOLUTION; OVERPOTENTIAL; PULSATING CURRENTS; SCANNING ELECTRON MICROSCOPE (SEM); SCANNING ELECTRON MICROSCOPIC; SQUARE-WAVE; TECHNOLOGICAL SIGNIFICANCE;

COPPER; COPPER DEPOSITS; ELECTRODEPOSITION; ELECTRON MICROSCOPES; HYDROGEN; MORPHOLOGY; SCANNING; SCANNING ELECTRON MICROSCOPY;

DEPOSITION;

EID: 77955716713     PISSN: 13882481     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.elecom.2010.03.021     Document Type: Article

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