Dielectric response of PTFE and ETFE wiring insulation to thermal exposure

IEEE Transactions on Dielectrics and Electrical Insulation

Volumn 17, Issue 4, 2010, Pages 1234-1241

  Li, L ^a   Bowler, N ^a   Kessler, M R ^a   Yoon, S H ^b  

^a Iowa State University   (United States)

^b Kumoh National Institute of Technology   (South Korea)

Author keywords

dissipation factor; ETFE; permittivity; PTFE; thermal exposure; Wiring insulation

Indexed keywords

AGILENT; CRYSTAL PHASE TRANSITION; CRYSTALLINITIES; DEGRADATION PROCESS; DIELECTRIC RESPONSE; DISSIPATION FACTOR; DISSIPATION FACTORS; FLUORO-POLYMERS; FREQUENCY RANGES; HEALTH MANAGEMENT; INSULATION MATERIALS; LCR METERS; MELTING TEMPERATURES; MOLECULAR RELAXATION; NOVOCONTROL DIELECTRIC SPECTROMETERS; POLAR GROUPS; ROOM TEMPERATURE; SLOW COOLING; TETRAFLUOROETHYLENE; THERMAL EXPOSURE; WIRE INSULATION;

ETHYLENE; FLUORINE CONTAINING POLYMERS; PERMITTIVITY MEASUREMENT; PHASE TRANSITIONS; PHOTORESISTS; THERMAL INSULATION;

PERMITTIVITY;

EID: 77955583482     PISSN: 10709878     EISSN: None     Source Type: Journal    
DOI: 10.1109/TDEI.2010.5539695     Document Type: Article

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