An ultra-wideband balun using multi-metal GaAs MMIC technology

IEEE Microwave and Wireless Components Letters

Volumn 20, Issue 8, 2010, Pages 474-476

  Lan, Xing ^a   Fong, Flavia ^a   Kintis, Mark ^a   Kono, Keith ^a   Yamauchi, Derrick ^a   Luo, Wen Ben ^a   Farkas, David ^a  

^a NORTHROP GRUMMAN CORPORATION   (United States)

Author keywords

Balun; monolithic microwave integrated circuit (MMIC); ultra wideband (UWB)

Indexed keywords

BALUN; BANDWIDTH RATIO; BENZOCYCLOBUTENE; GAAS; GAAS HEMT; MARCHAND BALUN; MAXIMUM AMPLITUDE; MAXIMUM PHASE; METAL LAYER; MMIC TECHNOLOGY; MULTI-METALS; TWO LAYERS;

BUTENES; GALLIUM ALLOYS; GALLIUM ARSENIDE; INTEGRATED CIRCUITS; MICROWAVE INTEGRATED CIRCUITS; SEMICONDUCTING GALLIUM; ULTRA-WIDEBAND (UWB);

MONOLITHIC MICROWAVE INTEGRATED CIRCUITS;

EID: 77955579950     PISSN: 15311309     EISSN: None     Source Type: Journal    
DOI: 10.1109/LMWC.2010.2050302     Document Type: Article

References (15)

1. N. Marchand, "Transmission line conversion transformers," Electronics, vol.17, pp. 142-145, 1944.
2. G. Oltman, "The compensated balun," IEEE Trans. Microw. Theory Tech., vol.14, no.3, pp. 112-119, Mar. 1966.
3. C. M. Tsai and K. C. Gupta, "A generalized model for coupled lines and its applications to two-layer planar circuits," IEEE Trans. Microw. Theory Tech., vol.40, no.12, pp. 2190-2199, Dec. 1992.
4. C. L. Goldsmith, A. Kikel, and N. L.Wilkens, "Synthesis of Marchand baluns using multilayer microstrip structures," Int. J. Microw. Milli. Wave Comput.-Aided Eng., vol.2, no.3, pp. 179-188, 1992.
5. D. M. L. Bartholomew, "Optimum design for a broadband microstrip balun," Electron. Lett., vol.13, no.17, pp. 510-511, Aug. 1977.
6. K. V. Puglia, "Electromagnetic simulation of some common balun structures," IEEE Microw. Mag., pp. 56-61, Sep. 2002.
7. A. C. Chen, M. J. Chen, and A. Pham, "Design and fabrication of ultrawideband baluns embedded in multilayer liquid crystal polymer flex," IEEE Trans. Adv. Packag., vol.30, no.3, pp. 533-540, Aug. 2007.
8. R. Schwindt and C. Nguyen, "Computed -aided analysis and design of a planar multilayer Marchand balun," IEEE Trans. Microw. Theory Tech., vol.42, no.7, pp. 1429-1434, Jul. 1994.
9. Z. Y. Zhang and K. Wu, "A broadband substrate integrated waveguide (SIW) planar balun," IEEE Microw. Wireless Comp. Lett., vol.17, no.12, pp. 843-845, Dec. 2007.
10. A. C. Chen, A. Pham, and R. E. Leoni, III, "Development of low-loss broadband baluns using multilayered organic thin-films," IEEE Trans. Microw. Theory Tech., vol.53, no.11, pp. 3648-3654, Nov. 2005.
11. C. S. Lin, P. S. Wu, M. C. Yeh, J. S. Fu, H. Y. Chang, K. Y. Lin, and H. Wang, "Analysis of multiconductor coupled-line Marchand baluns for miniature MMIC design," IEEE Trans. Microw. Theory Tech., vol.55, no.6, pp. 1190-1198, Jun. 2007.
12. K. Nishikawa, I. Toyoda, and T. Tokumitsu, "Compact and broadband three-dimensional MMIC balun," IEEE Trans. Microw. Theory Tech., vol.47, no.1, pp. 96-98, Jan. 1999.
13. Processing Procedure for Cyclotene Resins, The Dow Chemical Company [Online]. Available: http://www.dow.com/cyclotene/resource/ prodlit.htm
14. D. Linten, X. Sun, G. Carchon, W. Jeamsaksiri, A. Mercha, J. Ramos, S. Jenei, P. Wambacq, M. Dehan, L. Aspemyr, A. J. Scholten, S. Decoutere, S. Donnay, and W. De Raedt, "Low-power voltage-controlled oscillators in 90-nm CMOS using high-quality thin-film postprocessed inductors," IEEE Solid-State Circuits, vol.40, no.9, pp. 1922-1931, Sep. 2005.
15. D. S. Farkas, J. Uyeda, J. Wang, W. B. Luo, R. Elmadijan, D. Eaves, K. Luo, R. Lai, M. Barsky, M.Wojtowicz, and A. Oki, "Demonstration of a 3-D GaAs HEMT phase shifter MMIC utilizing a five layer BCB process with seven metal layers," in Proc. IEEE Comp. Semicond. Int. Circuits Symp., Oct. 2007, pp. 1-3.