Highly corrosion-resistant Cu70(Ni,Fe,Mn,Cr)30 cupronickel designed using a cluster model for stable solid solutions

Journal of Alloys and Compounds

Volumn 505, Issue 1, 2010, Pages 179-182

  Zhang, Jie ^a   Wang, Qing ^a   Wang, Yingmin ^a   Wen, Lishi ^a   Dong, Chuang ^a  

^a DALIAN UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Cluster plus glue atom model; Corrosion; Cu Ni

Indexed keywords

3.5%NACL; CLUSTER MODELS; CLUSTER-PLUS-GLUE-ATOM MODEL; CORROSION-RESISTANT; CU-NI; MATRIX; NEAREST NEIGHBORS; NI ATOMS; THERMAL STABILITY;

ATOMS; CHROMIUM; CORROSION RESISTANCE; CRYSTALLIZATION; ELECTROCHEMICAL CORROSION; GLUES; GLUING; IRON ALLOYS; MANGANESE; MANGANESE COMPOUNDS; SODIUM CHLORIDE; SOLID SOLUTIONS; SOLIDIFICATION;

COPPER ALLOYS;

EID: 77955573665     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2010.06.023     Document Type: Article

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