Self-healing of a high temperature cured epoxy using poly(dimethylsiloxane) chemistry

Polymer

Volumn 51, Issue 18, 2010, Pages 4063-4068

  Mangun, C L ^a   Mader, A C ^b   Sottos, N R ^c   White, S R ^c  

^a CU AEROSPACE   (United States)

^b HOCHSCHULE BREMEN   (Germany)

^c UNIVERSITY OF ILLINOIS AT URBANA CHAMPAIGN   (United States)

Author keywords

Autonomic materials; Microcapsules; Self healing

Indexed keywords

CANTILEVER BEAMS; CRACKS; CROSSLINKING; CURING; EPOXY RESINS; FRACTURE TESTING; MICROCHANNELS; MICROSTRUCTURE; ORGANOMETALLICS; RESINS; SELF-HEALING MATERIALS;

ADHESION PROMOTER; AUTONOMIC MATERIALS; CROSSLINKING REACTION; DOUBLE CANTILEVER BEAM; HIGH TEMPERATURE; MICROCAPSULES; POLYDIMETHYLSILOXANE PDMS; SELF-HEALING;

FRACTURE TOUGHNESS;

ADHESION; CATALYST; CROSS LINKING; CURING (CHEMISTRY); EPOXY RESIN; MICROCAPSULE; MOLECULAR WEIGHT; PHASE SEPARATION; POLYDIMETHYLSILOXANE; TEMPERATURE EFFECT; TOUGHNESS;

EID: 77955551261     PISSN: 00323861     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.polymer.2010.06.050     Document Type: Article

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