Thermal modeling of direct digital melt-deposition processes

Materials Science Forum

Volumn 654-656, Issue , 2010, Pages 1540-1544

  Cooper, Khershed P ^a   Lambrakos, Samuel G ^a  

^a NAVAL RESEARCH LABORATORY   (United States)

Author keywords

Melt deposition; Microstructure; Solidification; Thermal modeling

Indexed keywords

BEAMS AND GIRDERS; DEPOSITION; DISSIMILAR MATERIALS; FUNCTIONALLY GRADED MATERIALS; MICROSTRUCTURE; SENSITIVITY ANALYSIS; SOLIDIFICATION; THERMOANALYSIS;

ANISOTROPIC DIFFUSIVITY; INTEGRAL FORMULATIONS; MATERIAL COMPOSITIONS; MELT DEPOSITION; PARAMETER SENSITIVITIES; THERMAL MODEL; THERMO-PHYSICAL PROPERTY; THREE-DIMENSIONAL OBJECT;

INVERSE PROBLEMS;

EID: 77955480518     PISSN: 02555476     EISSN: 16629752     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/MSF.654-656.1540     Document Type: Conference Paper

References (5)

1. K.P. Cooper, Mat. Res. Soc. Symp. Proc. Vol. 758 (2003), p. LL1.4.1.
2. G.M. Fadel, S. Morvan et al., Solid Freeform Fabrication Proceedings, University of Texas, Austin, TX. (2001), p. 553.
3. K.P. Cooper and S.G. Lambrakos: submitted to Journal of Materials Engineering and Performance, (2010).
4. K.P. Cooper and S.G. Lambrakos, Supplemental Proceedings: Vol. 1: Fabrication, Materials, Processing and Properties, TMS, Warrandale, PA. (2009), p. 351.
5. S.G. Lambrakos and K.P. Cooper, Journal of Materials Engineering and Performance, (07 Jul 2009), published on-line.