Microstructural response of pure copper to cryogenic rolling

Acta Materialia

Volumn 58, Issue 16, 2010, Pages 5262-5273

  Konkova, T ^a   Mironov, S ^a,b   Korznikov, A ^a   Semiatin, S L ^c  

^a INSTITUTE FOR METALS SUPERPLASTICITY PROBLEMS   (Russian Federation)

^b TOHOKU UNIVERSITY   (Japan)

^c AIR FORCE RESEARCH LABORATORY   (United States)

Author keywords

Copper; Electron backscatter diffraction; Microstructure; Nanocrystalline materials; Texture

Indexed keywords

BRASS COMPONENTS; COMPLEX PROCESSES; CROSS-SLIP; CRYOGENIC TEMPERATURES; DISCONTINUOUS RECRYSTALLIZATION; ELECTRON BACK SCATTER DIFFRACTION; ELECTRON BACKSCATTER DIFFRACTION TECHNIQUE; GEOMETRICAL EFFECT; GRAIN SUBDIVISION; HIGH RESOLUTION; MICRO-STRUCTURAL; MICROSTRUCTURE EVOLUTIONS; NANO-CRYSTALLINE STRUCTURES; PURE COPPER; RECRYSTALLIZATIONS; ROOM TEMPERATURE; STATIC STORAGE; STRUCTURE DEVELOPMENT; TEXTURE EVOLUTIONS;

BACKSCATTERING; COPPER; CRYOGENICS; ELECTRON DIFFRACTION; RECRYSTALLIZATION (METALLURGY); TEXTURES; TWINNING;

NANOCRYSTALLINE MATERIALS;

EID: 77955431338     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2010.05.056     Document Type: Article

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