|
Volumn 49, Issue 2, 2010, Pages 226-235
|
Deformation twinning mechanism and its effects on the mechanical behaviors of ultrafine grained and nanocrystalline copper
|
Author keywords
Deformation twinning; Finite element method; Nanocrystalline copper; Yield strength
|
Indexed keywords
DEFORMATION BEHAVIOR;
DEFORMATION TWINNING;
EXPERIMENTAL OBSERVATION;
FACE-CENTERED CUBIC;
GRAIN SIZE;
LOADING EFFECTS;
LOG-NORMAL DISTRIBUTION;
MECHANICAL BEHAVIOR;
NANO-SCALE TWINS;
NANOCRYSTALLINE COPPER;
NANOCRYSTALLINES;
NUMERICAL SIMULATION;
REAL MICROSTRUCTURE;
TENSILE DEFORMATION;
TOPOLOGICAL MODELS;
TWINNING STRESS;
ULTRAFINE-GRAINED;
YIELD STRENGTH;
COMPUTER SIMULATION;
COPPER;
DEFORMATION;
FINITE ELEMENT METHOD;
GRAIN SIZE AND SHAPE;
MECHANICAL ENGINEERING;
MICROSTRUCTURE;
NORMAL DISTRIBUTION;
STRESS ANALYSIS;
YIELD STRESS;
TWINNING;
|
EID: 77955413392
PISSN: 09270256
EISSN: None
Source Type: Journal
DOI: 10.1016/j.commatsci.2010.04.044 Document Type: Article |
Times cited : (27)
|
References (50)
|