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Volumn 131, Issue 6, 2009, Pages
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Investigation of high-temperature printed circuit heat exchangers for very high temperature reactors
a a a a a |
Author keywords
Alloy 617; Compact heat exchanger; Diffusion bonding; Heat exchanger modeling; High temperature materials; PCHE; Photochemical machining
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Indexed keywords
COMPACT HEAT EXCHANGER;
HEAT EXCHANGER MODELING;
HIGH-TEMPERATURE MATERIALS;
PCHE;
PHOTOCHEMICAL MACHINING;
ALLOYS;
CERIUM ALLOYS;
COMPUTATIONAL FLUID DYNAMICS;
DESIGN;
DIFFUSION BONDING;
ELECTRONIC EQUIPMENT MANUFACTURE;
HELIUM;
HIGH TEMPERATURE REACTORS;
MACHINING;
PRINTED CIRCUITS;
TEST FACILITIES;
TESTING;
HEAT EXCHANGERS;
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EID: 77955316697
PISSN: 07424795
EISSN: 15288919
Source Type: Journal
DOI: 10.1115/1.3098425 Document Type: Article |
Times cited : (73)
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References (12)
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