Improved quality test method for solder ribbon interconnects on silicon solar cells

2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010

Volumn , Issue , 2010, Pages

  Wendt, J ^a   Trager M ^a   Klengel, R ^b   Petzold, M ^b   Schade, D ^a   Sykes, R ^a  

^a Q Cells SE ^*  (Germany)

^b FRAUNHOFER INSTITUTE FOR MECHANICS OF MATERIALS IWM   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CAMERA CONTROLS; COEFFICIENT OF THERMAL EXPANSION; DAMAGED CELLS; EFFICIENCY FACTOR; HIGH RELIABILITY; INTERCONNECTION RELIABILITY; INTERCONNECTION TECHNOLOGY; LOW COSTS; MICROELECTRONIC PACKAGING; QUALITY TEST; REGENERATIVE ENERGY; REPORTING TOOLS; REPRODUCIBLE TESTS; SOLDER INTERCONNECTIONS; SOLDERABILITY; SOLDERED RIBBONS; SOLDERING PROCESS; STANDARD TESTS; TEST METHOD; TEST STANDARDS; THERMO-MECHANICAL STRESS; TIME ANALYSIS;

BENCHMARKING; CELLS; COPPER; CUSTOMER SATISFACTION; CYTOLOGY; ELECTRONICS ENGINEERING; ELECTRONICS PACKAGING; LEAD; MICROELECTRONICS; QUALITY ASSURANCE; RELIABILITY; SEMICONDUCTING SILICON COMPOUNDS; SILICON SOLAR CELLS; SILICON WAFERS; SOLAR CELLS; SOLAR ENERGY; SOLAR POWER GENERATION; SOLDERING; STRESSES; TESTING; THERMAL EXPANSION; TOTAL QUALITY MANAGEMENT;

QUALITY CONTROL;

EID: 77955225588     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2010.5501299     Document Type: Conference Paper

References (3)

1. IEC 61189-3: Test methods for interconnection structures (printed boards)
2. J. Wendt:"The link between mechanical stress induced by soldering and micro damages in silicon solar cells"; 24th European Photovoltaic Solar Energy Conference, 21-25. September 2009, Hamburg, Germany
3. Gabor, A.M.: "Soldering Induced Damage To Thin Si Solar Cells And Detection Of Cracked Cells In Modules"; 21st European Photovoltaic Solar Energy Conference, 4-8 September 2006, Dresden, Germany