Cure behavior and physical properties of epoxy resin-filled with multiwalled Carbon nanotubes

Journal of Nanoscience and Nanotechnology

Volumn 10, Issue 4, 2010, Pages 2686-2693

  Guadagno, Liberata ^a   Naddeo, Carlo ^a   Vittoria, Vittoria ^a   Sorrentino, Andrea ^a   Vertuccio, Luigi ^a   Raimondo, Marialuigia ^a   Tucci, Vincenzo ^a   De Vivo, Biagio ^a   Lamberti, Patrizia ^a   Lannuzzo, Generoso ^b   Calvi, Erika ^b   Russo, Salvatore ^b  

^a UNIVERSITY OF SALERNO   (Italy)

^b ALENIA SPAZIO   (Italy)

Author keywords

Electrical properties; Multi walled carbon nanotubes; Percolation; Thermosetting matrix

Indexed keywords

BISPHENOL A; COMPOSITE SYSTEMS; CURE BEHAVIOR; CURE REACTIONS; DEGRADATION TEMPERATURES; ELECTRICAL CONDUCTIVITY; ELECTRICAL PROPERTY; EXPERIMENTAL PROCEDURE; HIGH-ENERGY BALL MILLING; MECHANICAL MIXING; PERCOLATION THRESHOLDS; POWER LAW; SMALL GAPS; THERMAL PROPERTIES; THERMOSETTING MATRICES; ULTRA-SONICATION;

BALL MILLING; CURING; ELECTRIC CONDUCTIVITY; EPOXY RESINS; ETHERS; GLASS; GLASS TRANSITION; MECHANICAL PROPERTIES; MULTIWALLED CARBON NANOTUBES (MWCN); PERCOLATION (COMPUTER STORAGE); PERCOLATION (FLUIDS); PERCOLATION (SOLID STATE); PHENOLS; RESINS; SOLVENTS; THERMODYNAMIC PROPERTIES; THERMOSETS;

CARBON NANOTUBES;

EID: 77954987790     PISSN: 15334880     EISSN: None     Source Type: Journal    
DOI: 10.1166/jnn.2010.1417     Document Type: Conference Paper

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