Simulation of residual stresses at holes in tempered glass: A parametric study

Materials and Structures/Materiaux et Constructions

Volumn 43, Issue 7, 2010, Pages 947-961

  Nielsen, J H ^a   Olesen, J F ^a   Poulsen, P N ^a   Stang, H ^a  

^a TECHNICAL UNIVERSITY OF DENMARK   (Denmark)

Author keywords

Bolted connections; Finite element simulation; Toughened glass

Indexed keywords

BOLTED CONNECTIONS; DESIGN TOOL; DIFFERENT GEOMETRY; FAR-FIELD STRESS; FINITE ELEMENT SIMULATIONS; GEOMETRIC FEATURE; HOLE DIAMETER; NUMERICAL STUDIES; PARAMETRIC STUDY; PLATE THICKNESS; RESIDUAL COMPRESSIVE STRESS; TEMPERED GLASS; TEMPERING PROCESS; TOUGHENED GLASS;

RESIDUAL STRESSES; THREE DIMENSIONAL;

GLASS;

EID: 77954760533     PISSN: 13595997     EISSN: None     Source Type: Journal    
DOI: 10.1617/s11527-009-9558-z     Document Type: Article

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