Formation of copper aluminate spinel and cuprous aluminate delafossite to thermally stabilize simulated copper-laden sludge

Journal of Hazardous Materials

Volumn 181, Issue 1-3, 2010, Pages 399-404

  Hu, Ching Yao ^a   Shih, Kaimin ^b   Leckie, James O ^c  

^a TAIPEI MEDICAL UNIVERSITY   (Taiwan)

^b UNIVERSITY OF HONG KONG   (Hong Kong)

^c Stanford University   (United States)

Author keywords

Alumina; Copper; Kaolinite; Sludge; Spinel

Indexed keywords

ALUMINA PRECURSOR; ALUMINA SYSTEMS; ALUMINATE SPINEL; AQUEOUS SOLUTIONS; CRISTOBALITES; CUPROUS OXIDE; DELAFOSSITES; DIFFUSION PROCESS; FORMATION MECHANISM; HIGHER TEMPERATURES; LEACHABILITY; MOLE RATIO; RATE-LIMITING STEPS; SINTERING CONDITION; SPINEL FORMATION; STABILIZATION MECHANISMS; THERMAL REACTIONS; TWO STAGE;

COPPER COMPOUNDS; HYDROCHLORIC ACID; KAOLINITE; LEACHING; SILICATE MINERALS; SINTERING; WAVELET TRANSFORMS;

COPPER;

ALUMINUM OXIDE; ALUMINUM SILICATE; CHLORIDE; COPPER; COPPER ALUMINATE SPINEL; COPPER DERIVATIVE; COPPER OXIDE; CUPROUS ALUMINATE DELAFOSSITE; CUPROUS OXIDE; SILICON DIOXIDE; UNCLASSIFIED DRUG; CUPRIC OXIDE; MAGNESIUM OXIDE; SEWAGE; SPINELL;

ALUMINUM OXIDE; AQUEOUS SOLUTION; COPPER; EXPERIMENTAL STUDY; HIGH TEMPERATURE; KAOLINITE; LEACHATE; LEACHING; SPINEL;

AQUEOUS SOLUTION; ARTICLE; HIGH TEMPERATURE; LEACHING; SLUDGE; THERMOSTABILITY; CHEMISTRY; HEAT; SEWAGE;

ALUMINUM OXIDE; COPPER; HOT TEMPERATURE; MAGNESIUM OXIDE; SEWAGE;

EID: 77954542829     PISSN: 03043894     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jhazmat.2010.05.024     Document Type: Article

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