Wear resistance of SiO2-doped Y-TZP grinding media during wet milling

International Journal of Applied Ceramic Technology

Volumn 7, Issue 4, 2010, Pages 502-511

  Ohnishi, Hiroshi ^a   Takeuchi, Miyuki ^a   Sekino, Tohru ^b   Ikuhara, Yuichi ^c   Niihara, Koichi ^d  

^a Nikkato Corporation   (Japan)

^b TOHOKU UNIVERSITY   (Japan)

^c UNIVERSITY OF TOKYO   (Japan)

^d NAGAOKA UNIVERSITY OF TECHNOLOGY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

GRAIN SIZE; GRINDING MEDIA; HIGH WEAR RESISTANCE; HYDRATION REACTION; ISO-PARAFFIN; LIQUID-PHASE METHOD; NON-AQUEOUS SOLVENTS; OPERATING TIME; SLURRY TEMPERATURE; WEAR RATES; WET MILLING; WORN SURFACE;

CONTRAST MEDIA; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; GRINDING (MACHINING); HYDRATION; SILICON COMPOUNDS; SLURRIES; SOLVENTS; YTTRIUM ALLOYS; ZIRCONIUM ALLOYS;

WEAR RESISTANCE;

EID: 77954336586     PISSN: 1546542X     EISSN: 17447402     Source Type: Journal    
DOI: 10.1111/j.1744-7402.2009.02360.x     Document Type: Article

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