Electrokinetic framework of dielectrophoretic deposition devices

Journal of Applied Physics

Volumn 107, Issue 12, 2010, Pages

  Burg, Brian R ^a   Bianco, Vincenzo ^b   Schneider, Julian ^a   Poulikakos, Dimos ^a  

^a ETH ZURICH   (Switzerland)

^b SECOND UNIVERSITY OF NAPLES   (Italy)

Author keywords

[No Author keywords available]

Indexed keywords

AC ELECTROOSMOSIS; CAPACITIVE COUPLINGS; CONDUCTIVE SUBSTRATES; CONDUCTIVITY CHANGES; COUPLING ELECTRODES; DC POTENTIAL; DEPOSITION EFFICIENCIES; DEVICE FABRICATIONS; DIELECTRIC ELECTRODES; DIELECTROPHORESIS; DIELECTROPHORETIC; DIELECTROPHORETIC ASSEMBLY; DIELECTROPHORETIC FORCES; DIFFERENT EFFECTS; DIRECT CURRENT; ELECTRIC DOUBLE LAYER; ELECTRIC FIELD STRENGTH; ELECTRODE GAP; ELECTROKINETIC; ELECTROOSMOTIC; ELECTROTHERMAL FLOW; FLUID FLOW; HIGH FREQUENCY; HIGH INTEGRATION DENSITY; HYDRODYNAMIC EFFECT; INHOMOGENEOUS ELECTRIC FIELDS; INITIAL FLOW; INTEGRATION MECHANISMS; LIMITING PROCESS; LOCAL TRAPPING; LOW CONCENTRATIONS; MECHANICAL EQUATIONS; METALLIC ELECTRODES; MOVING PARTICLES; NANOSTRUCTURED NETWORKS; NUMERICAL MODELING; SWNT DISPERSIONS; VELOCITY FIELD;

CARBON NANOTUBES; DIELECTRIC DEVICES; ELECTRIC FIELD MEASUREMENT; ELECTRIC FIELDS; ELECTRIC PROPERTIES; ELECTRODES; ELECTRODYNAMICS; ELECTROOSMOSIS; ELECTROPHORESIS; FLOW PATTERNS; NANOSTRUCTURES; PLATES (STRUCTURAL COMPONENTS); SINGLE-WALLED CARBON NANOTUBES (SWCN);

ENGINEERING EXHIBITIONS;

EID: 77954194816     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.3448497     Document Type: Article

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