Study on a C-class solvent-free silicone impregnating varnish

IEEE Transactions on Dielectrics and Electrical Insulation

Volumn 17, Issue 3, 2010, Pages 785-790

  Li, Qiangjun ^a   Zhong, Jinghe ^a   Li, Yong ^a   Wang, Kai ^a   Jiang, Qibin ^a   Chen, Hongsheng ^b  

^a Zhuzhou Times New Material Technology Co Ltd   (China)

^b Zhuzhou CSR Times Electric Co Ltd   (China)

Author keywords

Application technology; Silicone resin; Solvent free impregnating varnish; VPI

Indexed keywords

BEFORE AND AFTER; CONVENTIONAL METHODS; ELECTRIC DEVICES; HIGH TEMPERATURE; PHENYL GROUP; PROCESSING CONDITION; RIGID MEMBRANES; ROOM TEMPERATURE; SILICONE RESIN; SILOXANE COMPONENT; SOLVENT FREE; VACUUM PRESSURE IMPREGNATION; VPI;

CURING; ELECTRIC WINDINGS; OLIGOMERS; PLATINUM; RESINS; SILICONES; SOLVENTS; VARNISH; WINDING;

IMPREGNATION;

EID: 77954186427     PISSN: 10709878     EISSN: None     Source Type: Journal    
DOI: 10.1109/TDEI.2010.5492251     Document Type: Article

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