Use of carbon nanotubes reinforced epoxy as adhesives to join aluminum plates

Materials and Design

Volumn 31, Issue SUPPL. 1, 2010, Pages

  Yu, Suzhu ^a   Tong, Min Nah ^b   Critchlow, Gary ^b  

^a SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

^b LOUGHBOROUGH UNIVERSITY   (United Kingdom)

Author keywords

Adhesives; Carbon nanotubes; Durability; Nanocomposites; Wedge test

Indexed keywords

ADHESION PROPERTIES; ALUMINUM PLATES; BONDING STRENGTH; ELECTRICAL CONDUCTIVITY; EPOXY MATRICES; MECHANICAL STIRRING; PERCOLATION THRESHOLDS; REINFORCED EPOXY; SURFACE ELECTRICAL CONDUCTIVITY; TESTING CONDITIONS; THERMAL DEGRADATION TEMPERATURES; THERMAL STABILITY; ULTRA-SONICATION; UNDER WATER; WEDGE TEST;

ADHESIVES; ALUMINUM; DURABILITY; ELECTRIC CONDUCTIVITY; FRACTURE; FRACTURE TOUGHNESS; NANOCOMPOSITES; REINFORCED PLASTICS; SOLVENTS;

CARBON NANOTUBES;

EID: 77953807906     PISSN: 02641275     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matdes.2009.11.045     Document Type: Article

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