The microstructural basis for the mechanical properties and electrical resistivity of nanocrystalline Cu-Al2O3

Materials Science and Engineering: A

Volumn 527, Issue 20, 2010, Pages 5065-5071

  Nachum, S ^a   Fleck, N A ^a   Ashby, M F ^a   Colella, A ^b   Matteazzi, P ^c  

^a UNIVERSITY OF CAMBRIDGE   (United Kingdom)

^b CSGI   (Italy)

^c MBN Nanomateriali SpA   (Italy)

Author keywords

Dispersion strengthening; Electrical resistivity; Nano indentation; Nanocrystalline alloys; Shear bands

Indexed keywords

ALUMINA; ALUMINUM OXIDE; BALL MILLING; COMPRESSIVE STRENGTH; COPPER; DISPERSIONS; DISSOLVED OXYGEN; ELECTRIC CONDUCTIVITY; GRAIN BOUNDARIES; NANOCRYSTALLINE ALLOYS; NANOCRYSTALS; SHEAR BANDS;

ALUMINA PARTICLES; DISPERSION STRENGTHENING; ELECTRICAL RESISTIVITY; HOT EXTRUSION; MICRO-STRUCTURAL; NANO INDENTATION; NANO-ALUMINA; NANOCRYSTALLINE COPPER; NANOCRYSTALLINE CU; UNIAXIAL TENSILE STRENGTH;

TENSILE STRENGTH;

EID: 77953807065     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2010.04.070     Document Type: Article

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