Quantification of fatigue cracking in CT specimens with passive and active piezoelectric sensing

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 7649, Issue , 2010, Pages

  Yu, Jianguo ^a   Ziehl, Paul ^a   Zarate, Boris ^a   Caicedo, Juan ^a   Yu, Lingyu ^a   Giurgiutiu, Victor ^a   Metrovich, Brian ^b   Matta, Fabio ^a  

^a The Department of Mechanical Engineering   (United States)

^b University of Miami College of Engineering   (United States)

Author keywords

acoustic emission; bridge health monitoring; diagnosis; fatigue crack; piezoelectric wafer active sensors; prognosis; PWAS

Indexed keywords

ACTIVE SENSING; BRIDGE HEALTH MONITORING; BROADBAND SENSORS; COMPACT TENSION SPECIMEN; CRACK EXTENSION; CRACK GROWTH; CRACK SIZES; CT SPECIMENS; DATA INTERPRETATION; DETECTION CAPABILITY; EXPERIMENTAL DATA; FATIGUE CRACK; FATIGUE CRACKING; FATIGUE CRACKS; FIELD TEST; GROWING CRACKS; INDUCED SIGNAL; LONG TERM; MODEL UPDATING TECHNIQUES; NUMERICAL RESULTS; PASSIVE AND ACTIVE SENSING; PASSIVE SENSING; PIEZOELECTRIC WAFER ACTIVE SENSORS; REMAINING FATIGUE LIFE; STRUCTURAL HEALTH; WAVE FORMS;

ACOUSTIC EMISSION TESTING; ACOUSTIC EMISSIONS; AEROSPACE ENGINEERING; COMPOSITE MATERIALS; COMPOSITE MICROMECHANICS; DIAGNOSIS; FATIGUE CRACK PROPAGATION; FATIGUE OF MATERIALS; HEALTH; MONITORING; NUMERICAL ANALYSIS; PIEZOELECTRICITY; SECURITY SYSTEMS; SENSORS; STEEL BRIDGES; STRUCTURES (BUILT OBJECTS);

CRACK DETECTION;

EID: 77953366744     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.847945     Document Type: Conference Paper

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