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Volumn 59, Issue 2, 2010, Pages 236-241
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Influence of nanosilica particles on the cure and physical properties of an epoxy thermoset resin
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Author keywords
Dynamic mechanical thermal analysis; Epoxy resin; Functionalised nanosilica; Thermal mechanical analysis; Thermogravimatric analysis
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Indexed keywords
BISPHENOL A;
DIAMINODIPHENYLSULFONE;
DYNAMIC MECHANICAL THERMAL ANALYSIS;
EPOXY THERMOSETS;
EXPANSION COEFFICIENTS;
GLASS TRANSITION TEMPERATURE;
HIGH TEMPERATURE;
MODIFIED EPOXY;
NANO-SILICA;
NANOSILICA FILLER;
NANOSILICA PARTICLES;
NMR ANALYSIS;
SILICA LEVEL;
SILICA NANOPARTICLES;
STABLE NETWORK;
THERMAL MECHANICAL ANALYSIS;
THERMO-MECHANICAL ANALYSIS;
CURING;
DIFFERENTIAL SCANNING CALORIMETRY;
DYNAMIC ANALYSIS;
DYNAMIC MECHANICAL ANALYSIS;
DYNAMICS;
FUNCTIONAL POLYMERS;
GLASS TRANSITION;
NANOPARTICLES;
PHENOLS;
PHYSICAL PROPERTIES;
RESINS;
SILICA;
THERMOANALYSIS;
THERMOSETS;
EPOXY RESINS;
EPOXY RESIN;
FILLING MATERIAL;
GLASS TRANSITION TEMPERATURE;
PHYSICAL PROPERTY;
THERMAL ANALYSIS;
THERMOGRAVIMETRY;
THERMOSETTING POLYMER;
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EID: 77953348781
PISSN: 09598103
EISSN: 10970126
Source Type: Journal
DOI: 10.1002/pi.2714 Document Type: Article |
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Times cited : (32)
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References (10)
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