Improved IC debonding resistance of embedded NSM FRP plates

Proceedings of the 1st Asia-Pacific Conference on FRP in Structures, APFIS 2007

Volumn 2, Issue , 2007, Pages 865-870

  Haskett, M ^a   Oehlers, D ^a   Wu, C ^a  

^a School of the Civil and Environmental Engineering

Author keywords

Debonding; EB; FRP; NSM; Pull test

Indexed keywords

INTEGRATED CIRCUITS; PLATES (STRUCTURAL COMPONENTS); PLATING; REINFORCED CONCRETE; TIMING CIRCUITS;

EXTERNALLY BONDED; IC DEBONDING; MATERIAL PARAMETER; NEAR SURFACE MOUNTED; PARAMETRIC STUDY; PLATING MATERIALS; PLATING TECHNIQUE; REINFORCED CONCRETE MEMBER;

DEBONDING;

EID: 77953139140     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)

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