Thin polysilicon gauge for strain measurement of structural elements

IEEE Sensors Journal

Volumn 10, Issue 8, 2010, Pages 1320-1327

  Kim, Yongdae ^a   Kim, Youngdeok ^b   Lee, Chulsub ^b   Kwon, Sejin ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b Tyco Electronics AMP Korea Ltd   (South Korea)

Author keywords

Glass frit bonding; Microelectromechanical system (MEMS) strain gauge; Polysilicon strain gauge; Thin silicon strain gauge

Indexed keywords

GLASS FRIT; MICROELECTROMECHANICAL SYSTEMS; STRAIN GAUGE;

ATOMIC FORCE MICROSCOPY; CANTILEVER BEAMS; COMPOSITE MICROMECHANICS; GLASS; GLASS BONDING; MECHATRONICS; MEMS; METAL FOIL; METALS; MICROELECTROMECHANICAL DEVICES; NANOCANTILEVERS; POLYSILICON; SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS; STRAIN MEASUREMENT; TENSILE STRESS; THERMAL EXPANSION; THERMAL STRESS; THERMIONIC EMISSION;

STRAIN GAGES;

EID: 77952932510     PISSN: 1530437X     EISSN: None     Source Type: Journal    
DOI: 10.1109/JSEN.2009.2039565     Document Type: Article

References (25)

1. A. L. Window, Strain Gauge Technology, 2nd ed. London, U. K.: Elsevier Applied Science, 1992.
2. A. S. Khan and X. Wang, Strain Measurements and Stress Analysis. Upper Saddle River, NJ: Prentice-Hall, 2001.
3. M. F. Desrochers, G. W. Olsen, and M. K. Hudson, "A ground test rocket thrust measurement system," J. Pyrotechnics, vol. 14, pp. 50-55, 2001.
4. R. J. Stephen, K. Rajanna, V. Dhar, K. G. K. Kumar, and S. Nagabushanam, "Thin-film strain gauge sensors for ion thrust measurement," IEEE Sens. J., vol. 4, no. 3, pp. 373-377, Jun. 2004.
5. R. Smerd, S. Winkler, C. Salisbury, M. Worswick, D. Lloyd, and M. Finn, "High strain rate tensile testing of automotive aluminum alloy sheet," Int. J. Impact Eng., vol. 32, no. 1-4, pp. 541-560, 2005.
6. K. Rajanna, S. Mohan, M. M. Nayak, N. Gunasekaran, and A. E. Muthunayagam, "Pressure transducer with Au-Ni Thin-film strain gauges," IEEE Trans. Electron Devices, vol. 40, no. 3, pp. 521-524, Mar. 1993.
7. E. A. Tashkandi, B. R. Lang, and M. J. Edge, "Analysis of strain at selected bone sites of a cantilevered implant-supported prosthesis," J. Prosthet. Dent., vol. 76, no. 2, pp. 158-164, 1996.
8. H. K. Kang, C. Y. Ryu, C. S. Hong, and C. G. Kim, "Simultaneous measurement of strain, temperature and vibration frequency using a fibre optic sensor," J. Intell. Mater. Syst. Struct., vol. 12, pp. 277-281, 2001.
9. S. C. Redshaw, "A sensitive optical strain gauge," J. Sci. Instrum., vol. 16, no. 5, pp. 150-155, 1939.
10. R. S. Jerrett, "The acoustic strain gauge," J. Sci. Instrum., vol. 22, pp. 29-34, 1945.
11. H. I. S. Allwood and J. W. Drinkwater, "The acoustic strain gauge torsionmeter," J. Phys. E, Sci. Instrum., vol. 3, pp. 105-110, 1970.
12. The Pressure, Strain, and Force Handbook. Rhinebeck, NY: Omega Press LLC, 1996.
13. J. C. Anderson, "Thin film transducers and sensors," J. Vacuum Sci. Technol., vol. A4, no. 3, pp. 610-616, 1986.
14. S. Middelhoek, A. A. Bellekom, U. Dauderstadt, and J. French, "Review article: Silicon sensors," Meas. Sci. Technol., vol. 6, pp. 1641-1658, 1995.
15. W. P. Eaton and J. H. Smith, "Micromachined pressure sensors: Review and recent developments," Smart Mater. Struct., vol. 6, pp. 530-539, 1997.
16. E. S. Hwang, Y. J. Kima, and B. K. Ju, "Flexible polysilicon sensor array modules using "etch-release" packaging scheme," Sens. Actuators A, Phys., vol. 111, pp. 135-141, 2004.
17. P. Alpuim, V. Chu, and J. P. Conde, "Piezoresistive sensors on plastic substrates using doped microcrystalline silicon," IEEE Sensor J., vol. 2, no. 4, pp. 336-341, Aug. 2002.
18. S. Beeby, G. Ensell, M. Kraft, and N. White, MEMS Mechanical Sensor. Norwood, MA: Artech House, 2004.
19. M. L. Berre, P. Kleimann, B. Semmache, D. Barbier, and P. Pinard, "Electrical and piezoresistive characterization of boron-doped LPCVD polycrystalline silicon under rapid thermal annealing," Sens. Actuators A, Phys., vol. 54, pp. 700-703, 1996.
20. W. A. Leasure, N. Woodruff, and C. Gravel, "Glass-bonding techniques for semiconductor strain gauge," in Proc. SESA Spring Meeting, 1970, pp. 235-240.
21. R. Knechtel, "Glass frit bonding: A universal technology for wafer level encapsulation and packaging," Microsyst. Technol., vol. 12, pp. 63-68, 2005.
22. K. H. Hwang, K. H. Lee, G. J. Park, B. L. Lee, Y. C. Cho, and S. H. Lee, "Robust design of a vibratory gyroscope with an unbalanced inner torsion gimbal using axiomatic design," J. Micromech. Microeng., vol. 13, no. 1, pp. 8-17, 2003.
23. N. C. Lu, L. Gerzberg, and C. Y. Lu, "Modeling and optimization of monolithic polycrystalline silicon resistor," IEEE Trans. Electron Devices, vol. ED-28, no. 7, pp. 818-830, Jul. 1981.
24. S. M. Sze and K. K. Ng, Physics of Semiconductor Devices. Hoboken, NJ: Wiley, 2007.
25. N. K. Min, J. H. Chun, and C. W. Park, "Diaphragm-type pressure sensor with Cu-Ni thin film strain gauges-II: Design, fabrication, and characteristics of a pressure sensor," J. Korea Inst. Electr. Electron. Mater. Eng., vol. 10, no. 10, pp. 1022-1028, 1997.