A hybrid substrate for a temperature-compensated surface acoustic wave filter

Proceedings - IEEE Ultrasonics Symposium

Volumn , Issue , 2009, Pages 2631-2634

  Hori, Yuji ^a   Kobayashi, Hiroki ^a   Tohyama, Kazutoshi ^a   Iwasaki, Yasunori ^a   Suzuki, Kenji ^a  

^a NGK INSULATORS LTD   (Japan)

Author keywords

Hybrid substrate; SAW; Silicon; TCF; Temperature compensation

Indexed keywords

ACOUSTIC WAVES; SAWING; SILICON; SUBSTRATES; TEMPERATURE DISTRIBUTION;

BULK WAVE REFLECTION; ELECTRONIC CHARACTERISTICS; HYBRID SUBSTRATES; MINIMUM TEMPERATURES; PIEZOELECTRIC LAYERS; SURFACE ACOUSTIC WAVES; TEMPERATURE COMPENSATED; TEMPERATURE COMPENSATION;

ACOUSTIC SURFACE WAVE FILTERS;

EID: 77952811132     PISSN: 10510117     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ULTSYM.2009.5441626     Document Type: Conference Paper

References (5)

1. K. Yamanouchi, J. Tsutsumi, S. Inoue, Y. Iwamoto, Y. Satho, M. Ueda, and O. Ikata : "High-Frequency SAW Duplexer with Low-Loss and Steep Cut-Off Characteristics", Proc. IEEE Ultrasonics Symp., pp. 68-73 (2002)
2. M. Kadota, T. Nakao, N. Taniguchi, E. Takata, M. Mimura, K. Nishiyama, T. Hada, and T. Komura : "SAW Substrate with Coupling Factor and Excellent Temperatture Stability suitable for Duplexer of PCS in US", Proc. IEEE Ultrasonics Symp., pp. 1970-1975 (2004)
3. 2 Coat for Stabilizing Temperature Characteristics", Proc. IEEE Ultrasonics Symp., pp. 959-962 (2004)
4. K. Onish, A. Nanba, H. Sato, T. Ogura, S. Skei, Y. Taguchi, M. Tomita, O. Kawasaki, and K. Eda : "A Novel Temperature Compensation Method for SAW Devices Using Direct Bonding Techniques", Proc. IEEE Ultrasonics Symp., pp. 227-230 (1997)
5. M. Miura, T. Matsuda, Y. Satoh, M. Ueda, O. Ikata, Y. Ebata, and H. Takagi : "Temperature Compensated LiTaO3/S apphire Bonded SAW Substrate with Low Loss and High Coupling Factor Suitable for USPCS Application", Proc. IEEE Ultrasonics Symp., pp. 1322-1325 (2004)