Embedded capacitor technology using aerosol deposition

International Journal of Applied Ceramic Technology

Volumn 7, Issue SUPPL. 1, 2010, Pages

  Imanaka, Yoshihiko ^a   Akedo, Jun ^b  

^a FUJITSU LABORATORIES LTD   (Japan)

^b NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY AIST   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

AEROSOL DEPOSITION; CERAMIC FILM; CERAMIC NANOPARTICLES; CERAMIC POWDER; CIRCUIT BOARDS; CU ELECTRODE; DC VOLTAGE; DENSE FILMS; DEPOSITION TECHNOLOGY; DEPOSITION TEMPERATURES; DIELECTRIC CONSTANTS; ELECTRICAL FIELD; EMBEDDED CAPACITOR; EMBEDDED PASSIVES; FR4 SUBSTRATES; HIGH HUMIDITY; HIGH TEMPERATURE; INTERFACIAL BEHAVIORS; LOW DIELECTRIC CONSTANTS; MICROELECTRONIC PACKAGING; MILLED POWDERS; PARAELECTRICS; PASSIVE FUNCTIONS; POLYMER COMPONENTS; POLYMER COMPOSITE; PRINTED WIRING BOARDS; PROTOTYPE BOARDS; RAW POWDERS; RF MODULE; ROOM TEMPERATURE; THERMAL CYCLE;

ATMOSPHERIC AEROSOLS; BARIUM COMPOUNDS; CAPACITANCE; CAPACITORS; CERAMIC CAPACITORS; CERAMIC COATINGS; CERAMIC MATERIALS; CHIP SCALE PACKAGES; CRYSTAL STRUCTURE; DIELECTRIC FILMS; HYSTERESIS; MICROELECTRONICS; PERMITTIVITY; POLYMERS; PRINTED CIRCUIT BOARDS; RESINS; RESPIRATORY MECHANICS; RHODIUM;

COPPER;

EID: 77951700336     PISSN: 1546542X     EISSN: 17447402     Source Type: Journal    
DOI: 10.1111/j.1744-7402.2009.02359.x     Document Type: Article

References (13)

1. Development of Ubiquitous Service Using Wireless Technology NTT Tech. J., [3] 6 12 (2003).
2. Restructuring System on a Chip Strategy with Package Technology as the New Innovation Nikkei Microdevices, No. 189, 113-132, March (2001).
3. Activity Around Technology to Embed Devices Internally in PCB's Suddenly Increases Nikkei Electronics, No. 842, 57-64, March 3 (2003).
4. Y. Imanaka J. Akedo Passive Integration Technology for Microwave Application Using Aerosol Deposition Bull. Ceram. Soc. Jpn., 39 [8] 584 589 (2004).
5. Y. Imanaka J. Akedo "Integrated RF Module Produced By Aerosol Deposition Method" Proceedings of the 54th Electronic Components and Technology Conference, Las Vegas, NV, 1614-1621, June 2004.
6. 3 Thick Films Deposited by Aerosol Deposition Method Jpn. J. Appl. Phys., 38 [9B] 5397 5401 (1999). (Pubitemid 30514640)
7. 3 Thick Films Prepared for Microactuators by Aerosol Deposition Appl. Phys. Lett., 77 [11] 1710 1712 (2000).
8. J. Akedo M. Lebedev Ceramic Coating Technology Based on Impact Adhesion Phenomenon with Ultrafine Particles-Aerosol Deposition Method for High Speed Coating at Low Temperature Mater. Jpn., 41 [7] 459 466 (2002).
9. Y. Imanaka, M. Takenouchi J. Akedo Ceramic Dielectric Film for Microwave Filter Deposited at Room Temperature J. Cryst. Growth, 275 [1-2] e1313 e1319 (2005).
10. K. Uchino, E. Sadanaga T. Hirose Dependence of the Crystal Structure on Particle Size in Barium Titanate J. Am. Ceram. Soc., 72 [8] 1555 1558 (1989).
11. B. D. Begg, E. R. Vance J. Nowotny Effect of Particle Size on the Room-Temperature Crystal Structure of Barium Titanate J. Am. Ceram. Soc., 77 [12] 3186 3192 (1994).
12. 3 Ferroelectrics, 2 [1] 277 289 (1971).
13. Non-Ferrous Metal, The Japan Institute of Metal [in Japanese], 92 (1962).