Surface chemistry and topographical changes of an electropolished NiTi shape memory alloy

Physica Status Solidi (A) Applications and Materials Science

Volumn 207, Issue 4, 2010, Pages 807-811

  Neelakantan, Lakshman ^a   Valtiner, Markus ^a   Eggeler, Gunther ^b   Hasse, Achim Walter ^a,c  

^a MAX PLANCK INSTITUT FÜR EISENFORSCHUNG GMBH   (Germany)

^b RUHR UNIVERSITY BOCHUM   (Germany)

^c JOHANNES KEPLER UNIVERSITY LINZ   (Austria)

Author keywords

Anodic films; Electrodeposition; Etching; Phase transformation; Polishing; Roughness

Indexed keywords

BINARY ALLOYS; ELECTRODEPOSITION; ELECTROLYTIC POLISHING; ETCHING; PHASE TRANSITIONS; POLISHING; SHAPE MEMORY EFFECT; SULFUR COMPOUNDS; SURFACE CHEMISTRY; SURFACE ROUGHNESS; TITANIUM DIOXIDE; X RAY PHOTOELECTRON SPECTROSCOPY;

ANODIC FILMS; CHEMICAL NATURE; ELECTROPOLISHED; IN-SITU XRD; NITI SHAPE MEMORY ALLOYS; SURFACE FEATURE; THERMALLY INDUCED; TOPOGRAPHICAL CHANGES;

TITANIUM ALLOYS;

EID: 77951465370     PISSN: 18626300     EISSN: 18626319     Source Type: Journal    
DOI: 10.1002/pssa.200983312     Document Type: Article

References (22)

1. G. B. Kauffman and I. Mayo, J. Chem. Educ. 23, 4863 (1996).
2. T. Duerig, A. Pelton, and D. Stöckel, Mater. Sci. Eng. A 273- 275, 149 (1999).
3. S. A. Shabalovskaya, Int. Mater. Rev. 46, 1 (2001).
4. A. W. Hassel, Min. Invas. Ther. Allied. Technol. 13, 240 (2004).
5. D. A. Armitage and D. M. Grant, Mater. Sci. Eng. A 349, 89 (2003).
6. B. Thierry, M. Tabrizian, C. Trepanier, O. Savadg, and L'H. Yahia, J. Biomed. Mater. Res. 49, 88 (2000).
7. S. Trigwell, R. D. Hayden, K. F. Nelson, and G. Selvaduray, Surf. Interface Anal. 26, 483 (1998).
8. C. Trepanier, M. Tabrizian, L'H. Yahia, L. Bilodeau, and D. L. Piron, J. Biomed. Mater. Res. 43, 433 (1998).
9. M. Pohl, C. Hessing, and J. Frenzel, Mater. Corros. 53, 673 (2002).
10. S. Barison, S. Cattarin, S. Daolio, M. Musiani, and A. Tuissi, Electrochim. Acta 50, 11 (2004).
11. K. Fushimi, M. Stratmann, and A. W. Hassel, Electrochim. Acta 52, 1290 (2006).
12. L. Neelakantan and A. W. Hassel, Electrochim. Acta 53, 915 (2007).
13. K. Fushimi, L. Neelakantan, G. Eggeler, M. Stratmann, and A. W. Hassel, in preparation.
14. D. Landolt, Electrochim. Acta 32, 1 (1987).
15. M. Novak, A. K. N. Reddy, and H. Wroblowa, J. Electrochem. Soc. 117, 733 (1970).
16. J. L. Fang and N. J. Wu, J. Appl. Electrochem. 20, 231 (1990).
17. C. Bourauel, T. Fries, D. Drescher, and R. Plietsch, Eur. J. Orthod. 20, 79 (1998).
18. S. Hashimoto, A. Tanaka, A. Murata, and T. Sakurada, Surf. Sci. 556, 22 (2004).
19. O. Piotrowski, C. Madore, and D. Landolt, J. Electrochem. Soc. 145, 2362 (1998).
20. H. Heinrich and H. G. Feller, Metalloberfläche 38, 267 (1984).
21. J. Uchil, F. M. Braz Fernandez, and K. K. Mahesh, Mater. Charact. 58, 243 (2007).
22. Q. He, W. M. Huang, M. H. Hong, M. J. Wu, Y. Q. Fu, T. C. Chong, F. Chellet, and H. J. Du, Smart Mater. Struct. 13, 977 (2004).