SCOPUS 정보 검색 플랫폼

Volumn 13, Issue 6, 2010, Pages

Highly (111) textured copper foils with high hardness and high electrical conductivity by pulse reverse electrodeposition

(5) Sarada, Bulusu V a Pavithra, Ch L P a Ramakrishna, M a Rao, Tata N a Sundararajan, G a

a INTERNATIONAL ADVANCED RESEARCH CENTRE FOR POWDER METALLURGY AND NEW MATERIALS ARCI (India)

Author keywords

[No Author keywords available]

Indexed keywords

ANODIC PULSE; COPPER FOILS; ELECTRICAL CONDUCTIVITY; ELECTRODEPOSITION METHODS; FREE ELECTROLYTES; HIGH ELECTRICAL CONDUCTIVITY; HIGH HARDNESS; HIGHLY DENSE; MECHANICAL AND ELECTRICAL PROPERTIES; ORGANIC ADDITIVES; PULSE-REVERSE ELECTRODEPOSITION; ROOM TEMPERATURE; TEXTURE AND TWIN;

ADDITIVES; ELECTRIC CONDUCTIVITY; ELECTRODEPOSITION; HARDNESS; MECHANICAL PROPERTIES;

COPPER;

EID: 77951183868 PISSN: 10990062 EISSN: None Source Type: Journal
DOI: 10.1149/1.3358145 Document Type: Article

Times cited : (26)

References (29)

1
- 0142011564
- MIENEF 0167-9317,. 10.1016/S0167-9317(03)00420-9
- V. M. Dubin, Microelectron. Eng. MIENEF 0167-9317, 70, 461 (2003). 10.1016/S0167-9317(03)00420-9
- (2003) Microelectron. Eng. , vol.70 , pp. 461
- Dubin, V.M.¹

2
- 1842481757
- 0002-7820
- Y. Yamamoto, G. Sasaki, K. Yamakawa, and M. Ota, Hitachi Cable Review, 19, 65 (2000). 0002-7820
- (2000) Hitachi Cable Review , vol.19 , pp. 65
- Yamamoto, Y.¹ Sasaki, G.² Yamakawa, K.³ Ota, M.⁴

3
- 29144494486
- Tribological, mechanical and electrochemical properties of nanocrystalline copper deposits produced by pulse electrodeposition
- DOI 10.1088/0957-4484/17/1/012, PII S0957448406065901
- S. Tao and D. Y. Li, Nanotechnology NNOTER 0957-4484, 17, 65 (2006). 10.1088/0957-4484/17/1/012 (Pubitemid 41808019)
- (2006) Nanotechnology , vol.17 , Issue.1 , pp. 65-78
- Tao, S.¹ Li, D.Y.²

4
- 47249120886
- MSAPE3 0921-5093,. 10.1016/j.msea.2008.02.048
- W. Q. Cao, C. F. Gu, E. V. Pereloma, and C. H. J. Davies, Mater. Sci. Eng., A MSAPE3 0921-5093, 492, 74 (2008). 10.1016/j.msea.2008.02.048
- (2008) Mater. Sci. Eng., A , vol.492 , pp. 74
- Cao, W.Q.¹ Gu, C.F.² Pereloma, E.V.³ Davies, C.H.J.⁴

5
- 33748150929
- Pulsed electrodeposition of nanocrystalline Cu-Ni alloy films and evaluation of their characteristic properties
- DOI 10.1016/j.matlet.2005.12.065, PII S0167577X05013194
- I. Baskaran, T. S. N. Sankara Narayanan, and A. Stephen, Mater. Lett. MLETDJ 0167-577X, 60, 1990 (2006). 10.1016/j.matlet.2005.12.065 (Pubitemid 44308215)
- (2006) Materials Letters , vol.60 , Issue.16 , pp. 1990-1995
- Baskaran, I.¹ Sankara Narayanan, T.S.N.² Stephen, A.³

6
- 33845885795
- Effects of thermo-mechanical iterations on the grain boundary character distribution of Pb-Ca-Sn-Al alloy
- DOI 10.1016/j.msea.2006.09.034, PII S0921509306019733
- W. Wang and H. Guo, Mater. Sci. Eng., A MSAPE3 0921-5093, 445, 155 (2007). 10.1016/j.msea.2006.09.034 (Pubitemid 46024465)
- (2007) Materials Science and Engineering A , vol.445-446 , pp. 155-162
- Wang, W.¹ Guo, H.²

7
- 51349169387
- APPLAB 0003-6951,. 10.1063/1.2969409
- O. Anderoglu, A. Misra, H. Wang, F. Ronning, M. F. Hundley, and X. Zhang, Appl. Phys. Lett. APPLAB 0003-6951, 93, 083108 (2008). 10.1063/1.2969409
- (2008) Appl. Phys. Lett. , vol.93 , pp. 083108
- Anderoglu, O.¹ Misra, A.² Wang, H.³ Ronning, F.⁴ Hundley, M.F.⁵ Zhang, X.⁶

8
- 33644585347
- JAPIAU 0021-8979,. 10.1063/1.2173034
- D. Y. Li, Q. Chen, and X. Y. Wang, J. Appl. Phys. JAPIAU 0021-8979, 99, 044305 (2006). 10.1063/1.2173034
- (2006) J. Appl. Phys. , vol.99 , pp. 044305
- Li, D.Y.¹ Chen, Q.² Wang, X.Y.³

9
- 77951196493
- NIKGAV 0021-4876
- H. Tokuji and T. Sinji, J. Jpn. Inst. Met. NIKGAV 0021-4876, 67, 342 (2003).
- (2003) J. Jpn. Inst. Met. , vol.67 , pp. 342
- Tokuji, H.¹ Sinji, T.²

10
- 0032687002
- IETDAI 0018-9383,. 10.1109/16.766872
- C. Ryu, K. W. Kwon, A. L. S. Loke, H. Lee, T. Nogami, V. M. Dubin, R. A. Kavari, G. W. Ray, and S. S. Wong, IEEE Trans. Electron Devices IETDAI 0018-9383, 46, 1113 (1999). 10.1109/16.766872
- (1999) IEEE Trans. Electron Devices , vol.46 , pp. 1113
- Ryu, C.¹ Kwon, K.W.² Loke, A.L.S.³ Lee, H.⁴ Nogami, T.⁵ Dubin, V.M.⁶ Kavari, R.A.⁷ Ray, G.W.⁸ Wong, S.S.⁹

11
- 0344302504
- C. C. Koch, Editor, William Andrew Publishing, New York
- U. Erb, K. T. Aust, and G. Palumbo, in Nanostructured Materials Processing, Properties and Potential Applications, C. C. Koch, Editor, p. 179, William Andrew Publishing, New York (2002).
- (2002) Nanostructured Materials Processing, Properties and Potential Applications , pp. 179
- Erb, U.¹ Aust, K.T.² Palumbo, G.³

12
- 4544358607
- Ultrahigh strength and high electrical conductivity in copper
- DOI 10.1126/science.1092905
- L. Lu, Y. Shen, X. Chen, L. Qian, and K. Lu, Science SCIEAS 0036-8075, 304, 422 (2004). 10.1126/science.1092905 (Pubitemid 38499695)
- (2004) Science , vol.304 , Issue.5669 , pp. 422-426
- Lu, L.¹ Shen, Y.² Chen, X.³ Qian, L.⁴ Lu, K.⁵

13
- 14544288579
- ACMAFD 1359-6454
- L. Lu, R. Schwaiger, Z. W. Shan, M. Dao, K. Lu, and S. Suresh, Acta Mater. ACMAFD 1359-6454, 53, 2169 (2005).
- (2005) Acta Mater. , vol.53 , pp. 2169
- Lu, L.¹ Schwaiger, R.² Shan, Z.W.³ Dao, M.⁴ Lu, K.⁵ Suresh, S.⁶

14
- 34250892486
- Highly textured and twinned Cu films fabricated by pulsed electrodeposition
- DOI 10.1016/j.actamat.2007.04.009, PII S1359645407002510
- B. Z. Cui, K. Han, Y. Xin, D. R. Waryoba, and A. L. Mbaruku, Acta Mater. ACMAFD 1359-6454, 55, 4429 (2007). 10.1016/j.actamat.2007.04.009 (Pubitemid 46977812)
- (2007) Acta Materialia , vol.55 , Issue.13 , pp. 4429-4438
- Cui, B.Z.¹ Han, K.² Xin, Y.³ Waryoba, D.R.⁴ Mbaruku, A.L.⁵

15
- 70349973201
- JMMIEZ 0960-1317,. 10.1088/0960-1317/19/6/065011
- C. Gu, H. Xu, and T. -Y. Zhang, J. Micromech. Microeng. JMMIEZ 0960-1317, 19, 065011 (2009). 10.1088/0960-1317/19/6/065011
- (2009) J. Micromech. Microeng. , vol.19 , pp. 065011
- Gu, C.¹ Xu, H.² Zhang, T.-Y.³

16
- 0035262727
- ESLEF6 1099-0062,. 10.1149/1.1342144
- V. S. Donepudi, R. Venkatachalapathy, P. O. Ozemoyah, C. S. Johnson, and J. Prakash, Electrochem. Solid-State Lett. ESLEF6 1099-0062, 4, C13 (2001). 10.1149/1.1342144
- (2001) Electrochem. Solid-State Lett. , vol.4 , pp. 13
- Donepudi, V.S.¹ Venkatachalapathy, R.² Ozemoyah, P.O.³ Johnson, C.S.⁴ Prakash, J.⁵

17
- 30944463813
- Mechanism for Cu void defect on various electroplated film conditions
- DOI 10.1016/j.tsf.2005.07.062, PII S0040609005009223, Proceedings of the Third Asian Conference on Chemical Vapor Deposition (Third Asian-CVD), Third Asian CVD
- H. P. Feng, M. Y. Cheng, Y. L. Wang, S. C. Chang, Y. Y. Wang, and C. C. Wan, Thin Solid Films THSFAP 0040-6090, 498, 56 (2006). 10.1016/j.tsf.2005.07. 062 (Pubitemid 43113124)
- (2006) Thin Solid Films , vol.498 , Issue.1-2 , pp. 56-59
- Feng, H.P.¹ Cheng, M.Y.² Wang, Y.L.³ Chang, S.C.⁴ Wang, Y.Y.⁵ Wan, C.C.⁶

18
- 84861908440
- L. P. Bicelli, B. Bozzini, C. Mele, and L. D'Urzo, Int. J. Electrochem. Sci., 3, 356 (2008).
- (2008) Int. J. Electrochem. Sci. , vol.3 , pp. 356
- Bicelli, L.P.¹ Bozzini, B.² Mele, C.³ D'Urzo, L.⁴

19
- 0004234072
- M. Schlesinger and M. Paunivic, Editors, Cha, The Electrochemical Society, Pennington, NJ
- Modern Electroplating, M. Schlesinger, and, M. Paunivic, Editors, Chap., The Electrochemical Society, Pennington, NJ (2000).
- (2000) Modern Electroplating

20
- 38949134530
- ELCAAV 0013-4686,. 10.1016/j.electacta.2007.11.054
- M. S. Chandrasekar and M. Puspavanam, Electrochim. Acta ELCAAV 0013-4686, 53, 3313 (2008). 10.1016/j.electacta.2007.11.054
- (2008) Electrochim. Acta , vol.53 , pp. 3313
- Chandrasekar, M.S.¹ Puspavanam, M.²

21
- 34548674407
- AMETAR 0001-6160,. 10.1016/0001-6160(66)90168-4
- D. G. Brandon, Acta Metall. AMETAR 0001-6160, 14, 1479 (1966). 10.1016/0001-6160(66)90168-4
- (1966) Acta Metall. , vol.14 , pp. 1479
- Brandon, D.G.¹

22
- 0035827211
- A methodology for grain boundary plane assessment by single-section trace analysis
- DOI 10.1016/S1359-6462(01)00975-7, PII S1359646201009757
- V. Randle, Scr. Mater. SCMAF7 1359-6462, 44, 2789 (2001). 10.1016/S1359-6462(01)00975-7 (Pubitemid 32600011)
- (2001) Scripta Materialia , vol.44 , Issue.12 , pp. 2789-2794
- Randle, V.¹

23
- 3242666351
- ACMAFD 1359-6454,. 10.1016/j.actamat.2004.05.031
- V. Randle, Acta Mater. ACMAFD 1359-6454, 52, 4067 (2004). 10.1016/j.actamat.2004.05.031
- (2004) Acta Mater. , vol.52 , pp. 4067
- Randle, V.¹

24
- 0036189687
- A comparison between three-dimensional and two-dimensional grain boundary plane analysis
- DOI 10.1016/S0304-3991(01)00137-1, PII S0304399101001371
- V. Randle and H. Davies, Ultramicroscopy ULTRD6 0304-3991, 90, 153 (2002). 10.1016/S0304-3991(01)00137-1 (Pubitemid 34203636)
- (2002) Ultramicroscopy , vol.90 , Issue.2-3 , pp. 153-162
- Randle, V.¹ Davies, H.²

25
- 50649117731
- JALCEU 0925-8388,. 10.1016/j.jallcom.2007.11.125
- L. M. Chang, J. Alloys Compd. JALCEU 0925-8388, 466, L19 (2008). 10.1016/j.jallcom.2007.11.125
- (2008) J. Alloys Compd. , vol.466 , pp. 19
- Chang, L.M.¹

26
- 0037318511
- PSFMDH 0360-3164
- M. Aroyo and N. Tzonev, Plat. Surf. Finish. PSFMDH 0360-3164, 90, 50 (2003).
- (2003) Plat. Surf. Finish. , vol.90 , pp. 50
- Aroyo, M.¹ Tzonev, N.²

27
- 25644436339
- Characterization of electroplated copper self-annealing with investigations focused on incorporated impurities
- DOI 10.1016/j.mee.2005.07.059, PII S016793170500417X
- M. Stangl, J. Acker, V. Dittel, W. Gruner, V. Hoffmann, and K. Wetzig, Microelectron. Eng. MIENEF 0167-9317, 82, 189 (2005). 10.1016/j.mee.2005.07.059 (Pubitemid 41379081)
- (2005) Microelectronic Engineering , vol.82 , Issue.2 , pp. 189-195
- Stangl, M.¹ Acker, J.² Dittel, V.³ Gruner, W.⁴ Hoffmann, V.⁵ Wetzig, K.⁶

28
- 17444396381
- Effect of pulse-reverse current on microstructure and properties of electroformed nickel-iron mold insert
- DOI 10.1143/JJAP.44.1086
- Y. -M. Yeh, C. -S. Chen, M. -H. Tsai, Y. -C. Shyng, S. -Y. Lee, and K. -L. Ou, Jpn. J. Appl. Phys., Part 1 JAPNDE 0021-4922, 44, 1086 (2005). 10.1143/JJAP.44.1086 (Pubitemid 40540886)
- (2005) Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers , vol.44 , Issue.2 , pp. 1086-1090
- Yeh, Y.-M.¹ Chen, C.-S.² Tsai, M.-H.³ Shyng, Y.-C.⁴ Lee, S.-Y.⁵ Ou, K.-L.⁶

29
- 0037394443
- JAPIAU 0021-8979,. 10.1063/1.1555274
- H. Lee, S. S. Wong, and S. D. Lopatin, J. Appl. Phys. JAPIAU 0021-8979, 93, 3796 (2003). 10.1063/1.1555274
- (2003) J. Appl. Phys. , vol.93 , pp. 3796
- Lee, H.¹ Wong, S.S.² Lopatin, S.D.³

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.