The Preparation and cure kinetics researches of thermal conductivity Epoxy/AlN composites

Polymer - Plastics Technology and Engineering

Volumn 49, Issue 4, 2010, Pages 354-358

  Ma, Aijie ^a   Chen, Weixing ^a   Hou, Yonggang ^a   Zhang, Gai ^a  

^a XI'AN TECHNOLOGICAL UNIVERSITY   (China)

Author keywords

Composites; Cure Kinetics; Epoxy Resin; Thermal Conductivity

Indexed keywords

ALN; AUTOCATALYTIC; CASTING MOULDING METHODS; COMPOSITES; CURE KINETICS; CURE REACTIONS; CURING PROCESS; ISOTHERMAL DSC; WHOLE PROCESS;

ACTIVATION ENERGY; ALUMINUM NITRIDE; BLENDING; COUPLING AGENTS; CURING; IMPACT STRENGTH; MECHANICAL PROPERTIES; NITRIDES; RATE CONSTANTS; RESINS; THERMAL CONDUCTIVITY; THERMOANALYSIS;

EPOXY RESINS;

COMPOSITE; COMPOSITE PROPERTY; COUPLING AGENT; CURING (CHEMISTRY); EPOXY RESIN; KINETICS; MOLDING; THERMAL CONDUCTIVITY;

EID: 77951156925     PISSN: 03602559     EISSN: 15256111     Source Type: Journal    
DOI: 10.1080/03602550903532091     Document Type: Article

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