The effect of substrate on the microstructure and preferred orientation of nanocrystalline copper prepared by electrodeposition

Physica Status Solidi (C) Current Topics in Solid State Physics

Volumn 5, Issue 11, 2008, Pages 3522-3525

  Tjahyono, N I ^a   Chiu, Y L ^a,b  

^a UNIVERSITY OF AUCKLAND   (New Zealand)

^b UNIVERSITY OF BIRMINGHAM   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

DEPOSITION CURRENT DENSITY; GRAIN SIZE; HARRIS METHOD; HIGH PURITY COPPER; LOW CARBON; NANOCRYSTALLINE COPPER; ORIENTATION INDEX; PREFERRED ORIENTATIONS; SCHERRER METHOD; SEM;

AUSTENITIC STAINLESS STEEL; COPPER; ELECTRODEPOSITION; FILM PREPARATION; GROWTH (MATERIALS); NANOSTRUCTURES; SUPERCONDUCTING WIRE; SYNTHESIS (CHEMICAL); THIN FILMS; X RAY DIFFRACTION; ZINC PLATING;

LOW CARBON STEEL;

EID: 77951148605     PISSN: 18626351     EISSN: 16101642     Source Type: Journal    
DOI: 10.1002/pssc.200779417     Document Type: Conference Paper

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