Plastic circuit reliability and design for recycling

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn , Issue , 2009, Pages 858-862

  Thiel, David V ^a   Neeli, Madhusudanrao ^a   Raj, Sundra ^b  

^a GRIFFITH UNIVERSITY   (Australia)

^b FLEXTRONICS INTERNATIONAL   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CIRCUIT COMPONENTS; DESIGN FOR RECYCLING; LIQUID WASTES; NEW TECHNOLOGIES; PLASTIC CIRCUIT; PLASTIC SUBSTRATES; RECYCLING PROCESS; SCREEN-PRINTED; SOLID WASTE STREAMS; THERMAL MODELING; WATER PROOF;

ELECTRONICS INDUSTRY; ELECTRONICS PACKAGING; ENERGY CONVERSION; RECYCLING; SOLID WASTES; TECHNOLOGY;

PLASTICS;

EID: 77951078267     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2009.5416425     Document Type: Conference Paper

References (12)

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