Ultrasonic condition monitoring using thin-film piezoelectric sensors

Insight: Non-Destructive Testing and Condition Monitoring

Volumn 52, Issue 4, 2010, Pages

  Kirk, K J ^a   Elgoyhen, J ^a   Hood, J P ^a   Hutson, D ^a   Dwyer Joyce, R S ^b   Zhang, J ^c   Drinkwater, B W ^c  

^a UNIVERSITY OF THE WEST OF SCOTLAND   (United Kingdom)

^b UNIVERSITY OF SHEFFIELD   (United Kingdom)

^c UNIVERSITY OF BRISTOL   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVE MODE; ALUMINIUM NITRIDE; COMPONENT MATERIALS; EQUIVALENT CIRCUIT MODEL; HIGH CURIE TEMPERATURE; HIGH TEMPERATURE; LOW PROFILE; MAINTENANCE OUTAGES; OPERATING FREQUENCY; PASSIVE DETECTION; PULSE ECHOES; THIN FILM PIEZOELECTRIC; ULTRASONIC PULSE-ECHO TECHNIQUES;

ACOUSTIC EMISSION TESTING; ALUMINUM; ALUMINUM COMPOUNDS; FERRITE; FERRITIC STEEL; MACHINERY; NITRIDES; PIEZOELECTRIC DEVICES; PIEZOELECTRICITY; SENSORS; SILICON CARBIDE; STAINLESS STEEL; THIN FILM DEVICES; TITANIUM; TRANSDUCERS; ULTRASONIC TESTING; ULTRASONICS;

CONDITION MONITORING;

EID: 77950987082     PISSN: 13542575     EISSN: None     Source Type: Journal    
DOI: 10.1784/insi.2010.52.4.184     Document Type: Article

References (15)

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