Micro package of short term wireless implantable microfabricated systems

Proceedings of the 31st Annual International Conference of the IEEE Engineering in Medicine and Biology Society: Engineering the Future of Biomedicine, EMBC 2009

Volumn , Issue , 2009, Pages 6395-6399

  Bu, Leping ^a   Cong, Peng ^a,b   Kuo, Hung I ^a,b   Ye, Xuesong ^a   Ko, Wen ^a,b,c  

^a CASE WESTERN RESERVE UNIVERSITY   (United States)

^b IEEE   (United States)

^c APT Center ^*  (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COATED MATERIALS; FUNCTIONAL POLYMERS; MEMS; MICROANALYSIS; MICROFABRICATION; MULTILAYER FILMS; MULTILAYERS; POLYMERS; SILICONE COATINGS; SILICONES; SURFACE TREATMENT; TELEMETERING; THICKNESS MEASUREMENT;

ANALYSIS OF FAILURE MODES; ELECTRICAL PERFORMANCE; EVALUATION METHODS; LEAKAGE RESISTANCE; MICROFABRICATED SYSTEMS; MOISTURE PENETRATION; MULTI-LAYER-COATING; TISSUE COMPATIBILITY;

COATINGS;

EID: 77950967419     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IEMBS.2009.5333726     Document Type: Conference Paper

References (10)

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