Thermal management in high performance computers by use of heat pipes and vapor chambers, and the challenges of global warming and environment

IMPACT Conference 2009 International 3D IC Conference - Proceedings

Volumn , Issue , 2009, Pages 191-194

  Mochizuki, Masataka ^a   Nguyen, Thang ^a   Mashiko, Koichi ^a   Saito, Yuji ^a   Wu, Xiao Ping ^a   Nguyen, Tien ^a   Wuttijumnong, Vijit ^a  

^a FUJIKURA LTD   (Japan)

Author keywords

Computer cooling; Fan heat sink; Global warming; Heat pipe; Vapor chamber

Indexed keywords

AIR COOLING; ARCTIC OCEAN; CIRCUIT TECHNOLOGY; COMPUTER COOLING; COMPUTER COOLING FAN; COMPUTER PROCESSORS; DATA CENTERS; DESIGN CHANGE; FAN HEAT SINK; FAN-SINKS; HEAT DISSIPATION; HEAT TRANSFER DEVICE; HIGH PERFORMANCE COMPUTERS; HIGH PERFORMANCE PROCESSORS; HIGH-POWER; KEY FACTORS; NANO-SIZE; PARTIAL COOLING; POTENTIAL APPLICATIONS; POWER CONSUMPTION; POWER ELECTRIC; THERMAL MANAGEMENT; TWO PHASE FLUID; VAPOR CHAMBER;

AIR; COLD STORAGE; COOLING; COOLING SYSTEMS; DESIGN; ENVIRONMENTAL IMPACT; GAS EMISSIONS; GLOBAL WARMING; GREENHOUSE GASES; HEAT FLUX; HEAT PIPES; HEAT SINKS; INTEGRATED CIRCUITS; LEAKAGE (FLUID); OCEANOGRAPHY; SEA ICE; SUPERCOMPUTERS; TEMPERATURE CONTROL; THERMOELECTRIC EQUIPMENT; THREE DIMENSIONAL; VAPORS;

HEATING;

EID: 77950856723     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IMPACT.2009.5382144     Document Type: Conference Paper

References (6)

1. T. Nguyen, M. Mochizuki, K. Mashiko, Y. Saito, Use of Heat Pipe and Heat Sink for Thermal Management of High Performance CPU, Sixteenth Annual IEEE Semiconductor Thermal Management and Management Symposium - Semitherm XVI, March 21-23, 2000 San Jose, CA, USA.
2. th JSME-KSME Thermal Engineering Conference, October 1-6, 2000, Kobe, Japan.
3. st International Symposium on Micro & Nano Technology, 4-7 March 2004, Honolulu, Haiwai, USA.
4. M. Mochizuki, T. Nguyen, Y.Saito, V. Wuttijumnong, X. Wu, T. Nguyen, Revolution in Fan Heat Sink Cooling Technology to Extend and Maximize Air Cooling for High Performance Processor in Laptop/Desktop/Server Application, ASME Summer Heat Transfer Conference & InterPACK '05, July 17-22, 2005, San Francisco, USA.
5. th IHPC), April 22-27, 2007, Florianopolis, Brazil.
6. th International Heat Pipe Symposium (IHPS), November 17-20, 2008, Kuala Lumpur, Malaysia.