The transient coupled thermo-piezoelectric response of a functionally graded piezoelectric hollow cylinder to dynamic loadings

Proceedings of the Royal Society A: Mathematical, Physical and Engineering Sciences

Volumn 466, Issue 2116, 2010, Pages 1077-1091

  Babaei, M H ^a   Chen, Z T ^a  

^a UNIVERSITY OF NEW BRUNSWICK   (Canada)

Author keywords

Finite element; Functionally graded material; Piezoelectric material; Thermal relaxation

Indexed keywords

BEAMS AND GIRDERS; CRYSTALLOGRAPHY; CYLINDERS (SHAPES); DIFFERENTIAL EQUATIONS; DYNAMIC RESPONSE; ELECTRIC FIELDS; FINITE ELEMENT METHOD; FRACTURE; FUNCTIONALLY GRADED MATERIALS; LAPLACE TRANSFORMS; LOADING; MEMS; PIEZOELECTRIC DEVICES; PIEZOELECTRIC MATERIALS; RELAXATION PROCESSES;

AXISYMMETRIC LOADING; COUPLED PARTIAL DIFFERENTIAL EQUATIONS; DYNAMIC LOADINGS; FINITE ELEMENT; FUNCTIONALLY GRADED; GALERKIN; HOLLOW CYLINDERS; LAPLACE DOMAINS; LAPLACE INVERSIONS; MATERIAL PROPERTY; NON-FOURIER HEAT CONDUCTION; NONHOMOGENEITY; NUMERICAL SCHEME; PIEZOELECTRIC HOLLOW CYLINDER; PIEZOELECTRIC RESPONSE; THERMAL RELAXATION; THERMAL RELAXATION TIME; TRANSIENT THERMAL LOADING;

PIEZOELECTRICITY;

EID: 77950679652     PISSN: 13645021     EISSN: 14712946     Source Type: Journal    
DOI: 10.1098/rspa.2009.0543     Document Type: Article

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