Different microstructure BaO-B2O3-SiO2 glass/ceramic composites depending on high-temperature wetting affinity

Ceramics International

Volumn 36, Issue 4, 2010, Pages 1473-1478

  Cui, Xue min ^a,b   He, Yan ^a   Liang, Zhong yuan ^a   Zhang, He ^a   Zhou, Ji ^c  

^a GUANGXI UNIVERSITY   (China)

^b GUILIN UNIVERSITY OF ELECTRONIC TECHNOLOGY   (China)

^c TSINGHUA UNIVERSITY   (China)

Author keywords

Dielectrics; Electronic packaging; Glass ceramics; Wetting

Indexed keywords

ALUMINA POWDER; CAPILLARY PRESSURES; CERAMIC ADDITIVES; CERAMIC COMPOSITIONS; DIELECTRICS; DRIVING FORCES; ELECTRONIC PACKAGING; GLASS MATRICES; HIGH TEMPERATURE; HOMOGENEOUS MICROSTRUCTURE; OXIDE CERAMICS; RUTILE POWDERS; SINTERED BODY;

CONTACT ANGLE; CRYSTALLIZATION; DIELECTRIC LOSSES; DIELECTRIC MATERIALS; DIELECTRIC PROPERTIES OF SOLIDS; ELECTRONICS PACKAGING; GLASS CERAMICS; METALLIC GLASS; MICROSTRUCTURE; OXIDE MINERALS; PHASE SEPARATION; SILICON COMPOUNDS; SINTERED ALUMINA; SINTERING; WETTING;

CERAMIC MATRIX COMPOSITES;

EID: 77950516604     PISSN: 02728842     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ceramint.2010.01.005     Document Type: Article

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