SEE characterization and mitigation in ultra-deep submicron technologies

2009 IEEE International Conference on Integrated Circuit Design and Technology, ICICDT 2009

Volumn , Issue , 2009, Pages 112-115

  Mavis, David G ^a   Eaton, Paul H ^a   Sibley, M D ^a  

^a Microelectronics Research and Development Corporation   (United States)

Author keywords

Heavy ion testing; Milli Beam; Multiple bit upset; Single bit upset; Single event effects; Single event transient

Indexed keywords

COSMOLOGY; DATA ACQUISITION; ECONOMIC AND SOCIAL EFFECTS; ELECTRONIC EQUIPMENT TESTING; HARDENING; HEAVY IONS; INTEGRATED CIRCUIT MANUFACTURE; RADIATION EFFECTS; RADIATION HARDENING; SOFTWARE TESTING; SPACE APPLICATIONS;

HEAVY ION TESTING; MILLI-BEAM; MULTIPLE BIT UPSET; SINGLE EVENT EFFECTS; SINGLE EVENT TRANSIENTS; SINGLE-BIT;

TRANSIENTS;

EID: 77950303153     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICICDT.2009.5166276     Document Type: Conference Paper

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