Cohesive zone model applied to creep crack initiation at an interface edge between submicron thick films

International Journal of Damage Mechanics

Volumn 19, Issue 3, 2010, Pages 301-319

  Truong, Do Van ^a   Kitamura, Takayuki ^a  

^a KYOTO UNIVERSITY   (Japan)

Author keywords

Cohesive zone model; Crack initiation; Creep; Interface strength; Thin film

Indexed keywords

COHESIVE LAWS; COHESIVE ZONE MODEL; CREEP CRACK INITIATION; DAMAGE MECHANICS; FEM SIMULATIONS; FINITE ELEMENT CODES; INTERFACE STRENGTH; MICRO-CANTILEVERS; MICRO-ELECTRONIC DEVICES; PARAMETERS CHARACTERIZING; SILICON FILMS; STRESS SINGULARITIES; SUBMICRON; TIME CURVES; USER SUBROUTINE;

CRACK INITIATION; CREEP; CURVE FITTING; FINITE ELEMENT METHOD; MICROELECTRONICS; STRESS CORROSION CRACKING; THICK FILMS; THIN FILM DEVICES; THIN FILMS; TIN; TITANIUM COMPOUNDS;

CRACKS;

EID: 77950277830     PISSN: 10567895     EISSN: 15307921     Source Type: Journal    
DOI: 10.1177/1056789509103651     Document Type: Article

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