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Volumn , Issue , 2009, Pages 1117-1120

On-wafer integration of nitrides and Si devices: Bringing the power of polarization to Si

Author keywords

HEMT; High electron mobility transistor; Integration; MOSFET; Nitride semiconductors; Silicon

Indexed keywords

ALGAN/GAN; ANALOG TO DIGITAL CONVERTERS; HEMT; HIGH THERMAL STABILITY; HIGH-POWER; MIXED-SIGNAL ELECTRONICS; MOS-FET; NITRIDE LAYERS; NITRIDE SEMICONDUCTORS; ON-WAFER; POWER REGULATORS; POWER TRANSISTORS; SEAMLESS INTEGRATION; SI CMOS; SI DEVICES; SI(0 0 1); SPEED DIFFERENTIAL; SUBSTRATE REMOVAL; VIRTUAL SUBSTRATES; WAFER BONDING PROCESS;

EID: 77950003740     PISSN: 0149645X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/MWSYM.2009.5165897     Document Type: Conference Paper
Times cited : (5)

References (3)
  • 1
    • 33646871354 scopus 로고    scopus 로고
    • Moore's law: The future of Si microelectronics
    • June
    • S. E. Thompson and S. Parthasarathy, "Moore's law: the future of Si microelectronics," Materials Today, p 20, June 2006.
    • (2006) Materials Today , pp. 20
    • Thompson, S.E.1    Parthasarathy, S.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.