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Volumn , Issue , 2009, Pages 1117-1120
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On-wafer integration of nitrides and Si devices: Bringing the power of polarization to Si
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Author keywords
HEMT; High electron mobility transistor; Integration; MOSFET; Nitride semiconductors; Silicon
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Indexed keywords
ALGAN/GAN;
ANALOG TO DIGITAL CONVERTERS;
HEMT;
HIGH THERMAL STABILITY;
HIGH-POWER;
MIXED-SIGNAL ELECTRONICS;
MOS-FET;
NITRIDE LAYERS;
NITRIDE SEMICONDUCTORS;
ON-WAFER;
POWER REGULATORS;
POWER TRANSISTORS;
SEAMLESS INTEGRATION;
SI CMOS;
SI DEVICES;
SI(0 0 1);
SPEED DIFFERENTIAL;
SUBSTRATE REMOVAL;
VIRTUAL SUBSTRATES;
WAFER BONDING PROCESS;
ANALOG CIRCUITS;
CMOS INTEGRATED CIRCUITS;
DIFFERENTIAL AMPLIFIERS;
DIGITAL CIRCUITS;
DIGITAL DEVICES;
ELECTRON MOBILITY;
FABRICATION;
GALLIUM ALLOYS;
GALLIUM NITRIDE;
HIGH ELECTRON MOBILITY TRANSISTORS;
INSULATING MATERIALS;
INTEGRATION;
MICROWAVES;
MOSFET DEVICES;
POWER ELECTRONICS;
SILICON;
SILICON WAFERS;
SUBSTRATES;
THERMODYNAMIC STABILITY;
THERMOGRAVIMETRIC ANALYSIS;
TRANSISTORS;
WAFER BONDING;
SEMICONDUCTING SILICON COMPOUNDS;
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EID: 77950003740
PISSN: 0149645X
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/MWSYM.2009.5165897 Document Type: Conference Paper |
Times cited : (5)
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References (3)
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