Adsorption promotion of ag nanoparticle using cationic surfactants and polyelectrolytes for electroless cu plating catalysts

Journal of the Electrochemical Society

Volumn 157, Issue 4, 2010, Pages

  Fujiwara, Yutaka ^a   Kobayashi, Yasuyuki ^a   Sugaya, Takanori ^b   Koishikawa, Atsushi ^b   Hoshiyama, Yasuhiro ^b   Miyake, Hidekazu ^b  

^a OSAKA MUNICIPAL TECHNICAL RESEARCH INSTITUTE   (Japan)

^b KANSAI UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

AG NANOPARTICLE; CATIONIC POLYELECTROLYTE; COLLOIDAL SOLUTIONS; CU DEPOSITION; ELECTROLESS; ELECTROLESS CU PLATING; ELECTROSTATIC INTERACTIONS; FLUORINE DOPED TIN OXIDE; GLASS SUBSTRATES; GLASS SURFACES; HEAD GROUPS; HYDROPHOBIC INTERACTIONS; OXIDATION REACTIONS; POLY(DIALLYLDIMETHYLAMMONIUM CHLORIDE); QUATERNARY AMINES; SUBSTRATE SURFACE;

ADSORPTION; CATIONIC SURFACTANTS; CHLORINE COMPOUNDS; DYES; FLUORINE; GLASS; HYDROPHOBICITY; NANOPARTICLES; ORGANIC COMPOUNDS; POLYELECTROLYTES; SILVER; SOIL CONDITIONERS; TIN; TITANIUM COMPOUNDS;

SUBSTRATES;

EID: 77949690441     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.3306025     Document Type: Article

References (26)

1. Electroless Plating: Fundamentals and Applications, G. O. Mallory, and, J. B. Hajdu, Editors, American Electroplaters and Surface Finishers Society, Orlando, FL (1990).
2. H. Nakahara, in Printed Circuit Handbook, 6th ed., C. F. Coombs, Editor, Chap., McGraw-Hill, New York (2007).
3. M. Schlesinger, in Modern Electroplating, 4th ed., M. Schlesinger, and, M. Paunovic, Editors, p. 613, John Wiley & Sons, New York (2000).
4. A. P. Angelopoulos, J. B. Benziger, and S. P. Wesson, J. Colloid Interface Sci. 0021-9797, 185, 147 (1997). 10.1006/jcis.1996.4573
5. D. A. Luke, Trans. Inst. Met. Finish. 0020-2967, 60, 97 (1982).
6. T. Fujinami, J. Watanabe, T. Mizuguchi, H. Honma, and S. Magaino, J. Japan Inst. Electronics Packaging, 12, 160 (1997).
7. T. Shimoji, K. Otsuka, H. Aoki, and A. Yamagishi, J. Japan Inst. Electronics Packaging, 2, 209 (1999).
8. I. Ohno, O. Wakabayashi, and S. Haruyama, J. Electrochem. Soc. 0013-4651, 132, 2323 (1985). 10.1149/1.2113572
9. A. Vaškelis, A. Jagminien, L. Tamašauskait- Tmašinait, and R. Jušknas, Electrochim. Acta 0013-4686, 50, 4586 (2005). 10.1016/j.electacta.2004.10.093
10. Y. Fujiwara, Y. Kobayashi, K. Kita, R. Kakehashi, M. Noro, J. Katayama, and K. Otsuka, J. Electrochem. Soc. 0013-4651, 155, D377 (2008). 10.1149/1.2890288
11. Y. Fujiwara, H. Enomoto, T. Nagao, and H. Hoshika, Surf. Coat. Technol. 0257-8972, 169-170, 100 (2003). 10.1016/S0257-8972(03)00169-5
12. Y. Fujiwara, Y. Yarimizu, H. Enomoto, T. Narahara, and K. Funada, J. Surf. Finish. Soc. Jpn. 0915-1869, 50, 1173 (1999).
13. Y. Fujiwara, Y. Yarimizu, H. Enomoto, T. Narahara, and K. Funada, in Proceedings of the Third International Symposium on Electrochemical Technology Application in Electronics, L. T. Romankiw, T. Osaka, Y. Yamazaki, and, C. Madore, Editors, PV 99-34, p. 363, The Electrochemical Society Proceedings Series, Pennington, NJ (2000).
14. Y. Kobayashi and Y. Fujiwara, Kagaku to Kogyo (Osaka, Jpn.) 0368-5918, 82, 461 (2008).
15. H. Takahashi, Y. Kobayashi, H. Kouta, Y. Fujiwara, and S. Yoshihara, J. Surf. Finish. Soc. Jpn. 0915-1869, 58, 841 (2007). 10.4139/sfj.58.841
16. A. Hozumi, H. Sugimura, Y. Yokogawa, T. Kameyama, and O. Takai, Colloids Surf., A 0927-7757, 182, 257 (2001). 10.1016/S0927-7757(00)00820-7
17. S. Mori and H. Okamoto, Fusen, 27, 117 (1980).
18. D. C. Henry, Proc. R. Soc. London 0370-1662, 133, 106 (1931). 10.1098/rspa.1931.0133
19. N. M. van Os, J. R. Haak, and L. A. M. Rupart, Physico-Chemical Properties of Selected Anionic, Cationic, and Nonionic Surfactants, p. 109, Elsevier Science, New York (1993).
20. S. Siau, A. Vervaest, E. Schacht, and A. V. Calster, J. Electrochem. Soc. 0013-4651, 151, C133 (2004). 10.1149/1.1639159
21. S. Siau, A. Vervaest, S. Nalines, E. Schacht, and A. V. Calster, J. Electrochem. Soc. 0013-4651, 151, C816 (2004). 10.1149/1.1813991
22. S. Siau, A. Vervaest, S. Nalines, E. Schacht, and A. V. Calster, J. Electrochem. Soc. 0013-4651, 151, C831 (2004). 10.1149/1.1814011
23. Z. Tang, N. A. Kotov, S. Magonov, and B. Ozturk, Nature Mater. 1476-1122, 2, 413 (2003). 10.1038/nmat906
24. Y. Lvov, K. Ariga, M. Onda, I. Ichinose, and T. Kunitake, Langmuir 0743-7463, 13, 6195 (1997). 10.1021/la970517x
25. M. Paunovic, in Modern Electroplating, 4th ed., M. Schlesinger, and, M. Paunovic, Editors, p. 645, John Wiley & Sons, New York (2000).
26. J. -L. Lan, C. -C. Wan, and Y. -Y. Wang, J. Electrochem. Soc. 0013-4651, 155, K77 (2008). 10.1149/1.2838908